Accelerating cure time / Mohamed Saad in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 19, N° 6 (06/2012)  

[article]  inADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 19, N° 6 (06/2012) . - p. 34-36 Titre : Accelerating cure time : Cure time for thermically active adhesives can be accelerated by using infrated spot curing Type de document : texte imprimé Auteurs : Mohamed Saad, Auteur ; Elizabeth Brunet, Auteur Année de publication : 2012 Article en page(s) : p. 34-36 Langues : Américain (ame) Catégories : Adhésifs -- Séchage sous rayonnement infrarouge Adhésifs conducteurs Conducteurs organiques Epoxydes Microélectronique Polyimides Réticulation (polymérisation) Index. décimale : 668.3 Adhésifs et produits semblables En ligne : http://www.adhesivesmag.com/articles/91088-accelerating-cure-time Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19028 [article]

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Coatings innovations / Stuart Ganslaw in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 19, N° 3 (03/2012)  

[article]  inADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 19, N° 3 (03/2012) . - p. 22-23 Titre : Coatings innovations : The demand for conductive coatings in electronic devices continues to grow Type de document : texte imprimé Auteurs : Stuart Ganslaw, Auteur Année de publication : 2012 Article en page(s) : p. 22-23 Langues : Américain (ame) Catégories : Adhésifs conducteurs Conducteurs organiques Diélectriques Revêtement conducteur Revêtements protecteurs Résumé : Conductive coatings have been used for many years to control and isolate electromagnetic interference (EMI) and radio frequency interference (RFI) from the internal workings of electrical devices, and to limit EMI susceptibility from external sources. The interference may block, degrade, interrupt or limit the effective performance of an electrical circuit. In addition, conductive coatings have been used to ground sensitive electronic components and protect closed electronic devices against electrostatic discharge. As electronic devices have gotten smaller, thinner and more flexible, the demand for specialty conductive coatings has grown significantly. Dielectric coatings are also used in electronic devices to act as a protective layer over a conductive circuit, or as a barrier between conductive layers in multi-layered circuits, without degrading the electrical performance. En ligne : http://www.adhesivesmag.com/articles/90491-coatings-innovations Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19152 [article]

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Dispensing with toothpicks in ADHESIVES AGE, Vol. 42, N° 10 (10/1999)  

[article]  inADHESIVES AGE > Vol. 42, N° 10 (10/1999) . - p. 41 Titre : Dispensing with toothpicks : StanKraft replaces messy toothpicks with more efficient automatic dispensers Type de document : texte imprimé Année de publication : 1999 Article en page(s) : p. 41 Langues : Américain (ame) Catégories : Adhésifs -- Appareils et matériel Adhésifs conducteurs Argent Composants électriques et électroniques Epoxydes Matériaux -- Application-dosage Index. décimale : 668.3 Adhésifs et produits semblables Résumé : By switching from toothpick to automatic dispenser, StanKraft, Inc. Skokie, Ill., reported having cut its use of an expensive silver-filled epoxy by 50 percent and reduced assembly time from 30 to 5 minutes per part. StanKraft designs, and build custom membrane switches that are used in medical equipment, exercise machines, laboratory instruments and many other touch-pad applications. Because solderings, intense, localized heat could damage the flexible circuits inside the switches, the company uses a silver-filled conductive epoxy to attach electronic components. Note de contenu : - Toothpicks were slow, messy and inefficient - Dispensers save 25 minutes per assembly En ligne : https://drive.google.com/file/d/1_ZkdCB50oIdV8hzU-AVU1h0xuXpvtZIi/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=20046 [article]

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Electrical conductive adhesives with nanotechnologies / Yi Li / New York [United States] : Springer (2010)

Titre : Electrical conductive adhesives with nanotechnologies Type de document : texte imprimé Auteurs : Yi Li, Auteur ; Daniel Lu, Auteur ; C. P. Wong, Auteur Editeur : New York [United States] : Springer Année de publication : 2010 Importance : VI-437 p. Présentation : ill. Format : 24 cm ISBN/ISSN/EAN : 978-0-387-88782-1 Prix : 128 E Note générale : Index - Bibliogr. Langues : Américain (ame) Catégories : Adhésifs conducteurs Conduction électrique Nanotechnologie Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging, discussing the various electrical adhesive options currently available. The book focuses extensively on Electrically Conductive Adhesives (ECAs), as well as other adhesives such as lead-free soldering, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACFs) and Nonconductive Adhesives/Films (NCA/NCFs). The authors also present examples of how conductive adhesives can be applied to nano techniques, while making important mentions of recent research and development breakthroughs in the fields. Drawing upon tireless research, years of theoretical development and practical experience, and utilizing numerous visual examples and illustrative applications, authors CP Wong, Yi Li and Daniel Lu cover electrically conductive adhesives in depth, while also describing : The electrical properties, thermal performance, bonding pressure, assembly and reliability of numerous types of electrically conductive adhesives The similarities and differences between lead-free soldering techniques and electrically conductive adhesives, while also discussing the advantages of ECAs. Insights into the future of nano ECAs, as well as projections of future industry trends. Electrical Conductive Adhesives with Nanotechnologies is a must-read for both researchers and active engineers in the electronic packaging field. Note de contenu : - Nanotechnology - Characterizations of electrically conductive adhesives - Isotropically conductive adhesive (ICAs) - Anisotropically conductive adhesives/films (ACA/ACF) - Non-conductive adhesives/films (NCA/NCF) - Conductive nano-inks - Intrinsically conducting polymers (ICPs) - Future trend of conductive adhesive technology Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=25204

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Electrical conductive adhesives with nanotechnologies / Yi Li / New York [United States] : Springer (2010)

Titre : Electrical conductive adhesives with nanotechnologies Type de document : texte imprimé Auteurs : Yi Li, Auteur ; Daniel Lu, Auteur ; C. P. Wong, Auteur Editeur : New York [United States] : Springer Année de publication : 2010 Importance : XII-437 p. Présentation : ill. Format : 24 cm ISBN/ISSN/EAN : 978-1-4899-8307-7 Prix : 131 E Note générale : Index - Bibliogr. Langues : Anglais (eng) Catégories : Adhésifs conducteurs Conducteurs organiques Nanotechnologie Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability Note de contenu : - Nanotechnology - Characterizations of electrically conductive adhesives - Isotropically conductive adhesives (ICAs) - Anisotropically conductive adhesives/films (ACA/ACF) - Non-conductive adhesives/films (NCA/NCF) - Conductive nano-inks - Intrinsically conducting polymers (ICPs) - Future trend of conductive adhesive technology Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=30219

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Energizing product designs with electrically conductive adhesives / Deepak Hariharan in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 16, N° 6 (06/2009)  

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A flexible solution to solderless surface mount / E. Ralph Egloff in ADHESIVES AGE, Vol. 38, N° 13 (12/1995)  

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Influence of design properties of printed electronics on their environmental profile / Tobias Manuel Prenzel in MATERIAUX & TECHNIQUES, Vol. 109, N° 5-6 (2021)

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Making things stick when the going gets tough / Elisabeth Theunissen in EUROPEAN COATINGS JOURNAL (ECJ), N° 5 (05/2013)  

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On-site synthesis / David Diaz Diaz in EUROPEAN COATINGS JOURNAL (ECJ), N° 6 (06/2017)  

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Rewards for good conduct(ivity) / Arno Maurer in EUROPEAN COATINGS JOURNAL (ECJ), N° 2 (02/2016)  

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Short-circuiting corrosion / Anja Henckens in EUROPEAN COATINGS JOURNAL (ECJ), N° 05/2010 (05/2010)  

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Simplified construction of fuel cells / Elisabeth Stammen in ADHESION - ADHESIVES + SEALANTS, N° 1/2015 (2015)  

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A smart solution as alternative for soldering / Detlef Heindl in ADHESION - ADHESIVES + SEALANTS, N° 1/2016 (2016)  

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