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ADHESIVES AGE . Vol. 38, N° 13Flexible solution. Surface mount production without solder / Activated rubber particles for high performance / Acrylic emulsion laminates paper to foilMention de date : 12/1995 Paru le : 01/12/1995 |
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Ajouter le résultat dans votre panierA flexible solution to solderless surface mount / E. Ralph Egloff in ADHESIVES AGE, Vol. 38, N° 13 (12/1995)
[article]
Titre : A flexible solution to solderless surface mount Type de document : texte imprimé Auteurs : E. Ralph Egloff, Auteur Année de publication : 1995 Article en page(s) : p. 18-20 Langues : Américain (ame) Catégories : Adhésifs conducteurs
Conducteurs organiques
Couches épaisses
Electronique -- Matériaux
Electronique imprimée
Encapsulation
Encre électronique
PhotopolymèresIndex. décimale : 668.3 Adhésifs et produits semblables Résumé : Polymer thick film (PTF) technology for printed circuits has been used for a long time. Soldering onto the PTF has always been a problem and a multitude of ways have been devised to get around it. A flexible solution to solderless surface mount is a fully additive, fully compatible package of polymer thick film inks designed to enhance printed circuit technology. The package includes silver ink, dielectric ink, carbon ink, silver adhesive paste, and encapsulating photopolymer. These are used to attach surface mount devices (SMD) onto flexible polyester film when applied by screen print, stencil, and dot dispense methods. Early applications started with chip mount resistors, LEDs, or diodes. Improvements in technology have led to robust production with surface mounted active components.
Why should we use surface mount technology for flexible printed circuits? Everyone is trying to conform as quickly as possible to the Green revolution. Surface mount technology (SMT) for flexible printed circuitry (FPC) provides a clear means to lower costs and comply with environmental pressures while enhancing printed circuit functionality.
Performance is equal to copper etched circuits at speeds of up to 20 MHz at substantially lower costs, lighter weights and with the ability to be packaged into three dimensional cavities. Circuits for full travel keyboards, membrane switches, games, medical applications, sensors, displays and digitizers have used additive SMT worldwide for more than 10 years.Note de contenu : - Full additive and compatible
- Application
- Circuit design
- Choice of printer or prototype
- Environmental testingEn ligne : https://drive.google.com/file/d/1ugGH7Vj8To2TVCfHbm-USINaxZuFm-4O/view?usp=drive [...] Format de la ressource électronique : Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=20797
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Code-barres Cote Support Localisation Section Disponibilité 001058 - Périodique Bibliothèque principale Documentaires Disponible High performance acrylic emulsion for paper-to-foil laminating adhesive / Jose P. Lalas in ADHESIVES AGE, Vol. 38, N° 13 (12/1995)
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Titre : High performance acrylic emulsion for paper-to-foil laminating adhesive Type de document : texte imprimé Auteurs : Jose P. Lalas, Auteur Année de publication : 1995 Article en page(s) : p. 22-23 Langues : Américain (ame) Catégories : Adhésifs en phase aqueuse
Adhésion
Aliments -- Emballages
Copolymère éthylène acide acrylique
Huiles et graisses
Polyacryliques
Résistance à l'humidité:Résistance à l'eau
Résistance chimique
Résistance thermique
StratifiésIndex. décimale : 668.3 Adhésifs et produits semblables Résumé : Paper-to-foil lamination is used to manufacture packaging materials for a variety of foods, such as margarine, butter and oily snack foods. Casein/SBR and ethylene acrylic acid (EAA) adhesive technologies currently dominate the paper-to-foil laminating market. Casein/SBR offers the adhesive formulator adhesion, water resistance and heat resistance. However, these advantages are offset by odors due to the SBR component and the increasing price fluctuation and variable quality of casein. EAA offers the advantage of low odor and better grease resistance than the casein/SBR system, but at high costs. With the disadvantages associated with existing technologies, there is a need for a new laminating adhesive polymer that delivers a more attractive balance of cost and performance. Note de contenu : - Laminate preparation
- Adhesion
- Water resistance
- Blister/Tunneling, static test
- Heat resistance
- Grease resistanceEn ligne : https://drive.google.com/file/d/1xElVMYRF37d1Zhca0_xm1lakPwvaDT4o/view?usp=drive [...] Format de la ressource électronique : Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=20798
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Code-barres Cote Support Localisation Section Disponibilité 001058 - Périodique Bibliothèque principale Documentaires Disponible Surface-activated rubber particles improve structural adhesives / Michael J. Gerace in ADHESIVES AGE, Vol. 38, N° 13 (12/1995)
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Titre : Surface-activated rubber particles improve structural adhesives Type de document : texte imprimé Auteurs : Michael J. Gerace, Auteur ; Janet M. Gerace, Auteur ; Mark A. Williams, Auteur Année de publication : 1995 Article en page(s) : p. 26-31 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Adhésifs structuraux
Assemblages collés
Caoutchouc
Epoxydes
Formulation (Génie chimique)
Mouillage (chimie des surfaces)
Polyuréthanes
Résistance au cisaillementIndex. décimale : 668.3 Adhésifs et produits semblables Résumé : Perhaps the most critical characteristic for an adhesive in its end use is the strength of the bond it forms. In practice, many factors can affect adhesive joint strength, including the internal strength of the adhesive, the ability of the adhesive to wet the substrate, the bond thickness, and the adhesive bonding area. The internal strength of the adhesive is often related to its modulus, which is a measure of the stiffness of the material. As a rule of thumb, both very high or very low modulus materials are undesirable as adhesives. A material with too high a modulus will tend to be brittle, causing the material to crack under stress. A low modulus material is often weak and tears easily.
Rubber can be used as a modulus modifier in many adhesives. This tough, flexible material resists both cracking and tearing. Because of its desirable elastomeric properties, rubber can be used to modify materials with unacceptable moduli. Unfortunately, rubbers are incompatible with many structural adhesives because many rubbers are nonpolar, and the ingredients in many structural adhesives are polar in nature.
The purpose of this paper is to introduce Vistamer rubber, a low-cost, surface-activated rubber particle that is readily incorporated into structural adhesive formulations. Vistamer rubber makes it possible to combine the elasticity and toughness of rubber with the desirable properties of polar structural adhesives. The following sections will explore some fundamentals of adhesion and demonstrate how moduli can affect adhesive properties. Then we will discuss Vistamer rubber and see how it has increased the adhesive strength of two structural adhesive systems, an epoxy and a polyurethane. Testing indicates that Vistamer rubber can be used as a "modulus modifier" that either reduces the modulus of a brittle adhesive or increases the modulus of a weak adhesive. The benefit to the formulator is a single, low-cost material that can improve the strength and flexibility of structural adhesives.Note de contenu : - FUNDAMENTALS OF ADHESION : Adhesives forces - Surface wetting - Adhesive joint - Adhesive modulus
- VISTAMER RUBBER
- VISTAMER RUBBER IN AN EPOXY ADHESIVE
- VISTAMER RIBBER IN A POLYURETHANE ADHESIVEEn ligne : https://drive.google.com/file/d/1vVKGivweoryDnW6SIjgAeDTOXzTwro05/view?usp=drive [...] Format de la ressource électronique : Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=20799
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Code-barres Cote Support Localisation Section Disponibilité 001058 - Périodique Bibliothèque principale Documentaires Disponible Water dispersible hot melt adhesive raw material / Richard A. Miller in ADHESIVES AGE, Vol. 38, N° 13 (12/1995)
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Titre : Water dispersible hot melt adhesive raw material Type de document : texte imprimé Auteurs : Richard A. Miller, Auteur ; Scott E. George, Auteur Année de publication : 1995 Article en page(s) : p. 32-36 Langues : Américain (ame) Catégories : Adhésifs -- Recyclage
Adhésifs en phase aqueuse
Adhésifs thermofusibles
Aliments -- Emballages
Formulation (Génie chimique)
Polyesters
Polymères -- Propriétés physiques
Polymères ramifiésIndex. décimale : 668.3 Adhésifs et produits semblables Résumé : The properties of a water-dispersible branched polyester suggest its use in the formulation of a variety of aqueous and hot melt adhesives with improved recycling characteristics. Due to its superior adhesion to olefin film and its non-dispersibility in high ionic strength mediums such as simulated body fluids, water-dispersible branched polyester should be an excellent base polymer for adhesives used in packaging and nonwoven product assembly applications.
Advantages of the water-dispersible branched polyester include:
- readily dispersible in common tap water
- non-dispersible in ionic solutions (similar to body fluids)
- range of viscosities available
- low odor
- light to clear color
Research into the chemistry of polyesters is an ongoing program, and the future should see the introduction of other new products based on these materials.Note de contenu : - Technical aspects of polyesters
- Incorporation into adhesive formulations
- Physical properties of branched polyesters
- Aqueous dispersionsEn ligne : https://drive.google.com/file/d/1WbzwNEHjKm-rR9pMCPJqQq-EtDvxsOT4/view?usp=drive [...] Format de la ressource électronique : Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=20800
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