Titre : |
UV & EB cross linkable water based pressure sensitive adhesives |
Type de document : |
texte imprimé |
Auteurs : |
Abhishek Bang, Auteur ; Prathamesh Kharkar, Auteur |
Année de publication : |
2009 |
Article en page(s) : |
p. 95-100 |
Langues : |
Anglais (eng) |
Catégories : |
Adhésifs -- Séchage sous rayonnement électronique Adhésifs -- Séchage sous rayonnement ultraviolet Adhésifs sensibles à la pression
|
Index. décimale : |
668.3 Adhésifs et produits semblables |
Résumé : |
Pressure sensitive adhesives are materials that form a bond with very light pressure. The cured adhesive is neither solid nor liquid, but rather is a vicoelastic material that is usually quite tacky. Pressure sensitive adhesives are generally categorized into solvent based, water based and radiation cured adhesives. The former covers larger share in the market, but with realization of high VOC (Volatile Organic Content) and effects on environment, major focus is shifted to water based adhesives. The advantages of water-based PSAs are the abatement of air pollution (low VOC) and generally enhanced oxidation resistance of the final film. Radiation cured adhesives are now being employed because of their advantages over other two methods but it too has limitations. It is necessary to utilize the advantages using combination of above methods. This article mainly discusses about the radiation cured water based adhesives - its synthesis and application. Radiation cured water based adhesives do not currently command a significant market share but the interes remains high in this type of pressure sensitive adhesive technology. A number of important relationships between the proportion of these adhesives and both cure and formulating parameters have been uncovered. Use of these relationships can significantly enhance the chances or designing and optimizing superior ultraviolet/electron beam cured water based pressure sensitive adhesives. |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=6933 |
in PAINTINDIA > Vol. LIX, N° 1 (01/2009) . - p. 95-100