Titre : |
Robust surface with thermally stable hydrophobicity enabled by electrosprayed fluorinated SiO2 particles |
Type de document : |
texte imprimé |
Auteurs : |
Haojun Liu, Auteur ; Yunxi Zhang, Auteur ; Zhijun Ma, Auteur ; Hang Zhang, Auteur |
Année de publication : |
2022 |
Article en page(s) : |
p. 347-353 |
Note générale : |
Bibliogr. |
Langues : |
Américain (ame) |
Catégories : |
Caractérisation Chimie des surfaces Dioxyde de silicium Hydrophobie Particules (matières) Pulvérisation électrostatique Stabilité thermique Système de pulvérisation (technologie)
|
Index. décimale : |
667.9 Revêtements et enduits |
Résumé : |
Highly hydrophobic surface property is important for many applications, such as anticorrosion, antifogging, and antifouling. With regard to some practical applications, both mechanical endurance and thermal stability are essential. Here, we report a new method for making highly hydrophobic surfaces with simultaneously enhanced mechanical endurance and thermal stability. Such high-performance hydrophobic surfaces were prepared by coating electrospraying derived fluorinated SiO2 particles on various substrates, including glass slide, ceramic wafer, metal foil, and polymer sheet, with methyl silicone resin as the binder. Fluorinate silane was homogenously doped in the matrix of SiO2 particles, which can provide excellent protection effect. Meanwhile, the thermally stable methyl silicone resin can afford strong binding force between SiO2 particles and the substrates. Therefore, the hydrophobic surfaces created here possess both high mechanical endurance and excellent thermal stability. |
Note de contenu : |
- Experimental : Fabrication of thermally stable hydrophobic surface
- Characterization |
DOI : |
https://doi.org/10.1007/s11998-021-00540-7 |
En ligne : |
https://link.springer.com/content/pdf/10.1007/s11998-021-00540-7.pdf |
Format de la ressource électronique : |
Pdf |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=37163 |
in JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH > Vol. 19, N° 1 (01/2022) . - p. 347-353