[article]
| Titre : |
Crosslinked PA6 for circuit carriers |
| Type de document : |
texte imprimé |
| Auteurs : |
Zaneta Brocka, Auteur ; Gottfried Wilhelm Ehrenstein, Auteur |
| Année de publication : |
2004 |
| Article en page(s) : |
p. 88-94 |
| Note générale : |
Bibliogr. |
| Langues : |
Anglais (eng) |
| Index. décimale : |
668.4 Plastiques, vinyles |
| Résumé : |
Radiation-induced crosslinking - By post-crosslinking with an electron beam, it is possible to prevent engineering thermoplastics such as polyamide 6 from softening or melting. A definite improvement in the stability during soldering is the result. The crosslinking of plastics provides a very effective method for modifying the properties of engineering thermoplastics, particularly with regard to the current lead problem for the production of circuit carriers. |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=7640 |
in KUNSTSTOFFE PLAST EUROPE > Vol. 94, N° 11/2004 (11/2004) . - p. 88-94
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Crosslinked PA6 for circuit carriers in KUNSTSTOFFE PLAST EUROPE, Vol. 94, N° 11/2004 (11/2004)
