[article]
| Titre : |
Hot-embossed MID modules for enhanced thermal requirements |
| Type de document : |
texte imprimé |
| Auteurs : |
Florian Schüssler, Auteur |
| Année de publication : |
2009 |
| Article en page(s) : |
p. 72-76 |
| Note générale : |
Bibliogr. |
| Langues : |
Anglais (eng) |
| Index. décimale : |
668.4 Plastiques, vinyles |
| Résumé : |
HT thermoplastics - Automotive microelectronic systems often have to withstand elevated ambient temperatures of the kind found under the hood. For this reason, specially selected high-temperature (HT) thermoplastics, which serve as the base materials for hot-embossed electronic modules, were subjected to comprehensive qualification tests. |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=6985 |
in KUNSTSTOFFE INTERNATIONAL > Vol. 99, N° 11/2009 (11/2009) . - p. 72-76
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Hot-embossed MID modules for enhanced thermal requirements in KUNSTSTOFFE INTERNATIONAL, Vol. 99, N° 11/2009 (11/2009)
