Direct packaging of components / Torsten Maenz in KUNSTSTOFFE INTERNATIONAL, Vol. 111, N° 6 (2021)  

[article]  inKUNSTSTOFFE INTERNATIONAL > Vol. 111, N° 6 (2021) . - p. 12-16 Titre : Direct packaging of components : Thermoset injection molding of packages for electronic devices Type de document : texte imprimé Auteurs : Torsten Maenz, Auteur ; Martin Giersbeck, Auteur ; Gerrit Hülder, Auteur ; Armin Kech, Auteur Année de publication : 2021 Article en page(s) : p. 12-16 Langues : Anglais (eng) Catégories : Emballages en matières plastiques Equipements électroniques ou électriques (EEE) Matières plastiques -- Moulage par injection Matières plastiques -- Surmoulage Thermodurcissables Index. décimale : 668.4 Plastiques, vinyles Résumé : Thermosets are being increasingly used for packaging electronic devices, and offer good properties for this application. Direct overmolding of the components is particularly interesting here. However, achieving a successful product requires striking a balance between processability, thermal conductivity and reproducibility. Note de contenu : - More gentle processing compared to thermoplastics - Special features of the filling behavior - Power loss and thermal conductivity not proportional - Failures with to high cavity pressure - Differences between simulation and reality - Figure : In direct packaging, the electronic devices or components are directly overmolded with the molding compound - Fig. 1 : Thermal conductivity depending on the flow direction for different sheet thicknesses: with increasing sheet thickness, the thermal conductivity decreases in the x-direction and increases in the z-direction - Fig. 2 : Thermal conductivity (left) and power consumption (right; with/without convection) for 2 mm thick sheets of different thermoset molding compounds: the thermal conductivity and power consumption of the materials increase disproportionately to one another - Fig. 3 : Comparison of the cavity pressures for materials with lower (left) and higher (right) viscosity: at lower viscosity, the cavity pressure is significantly lower - Fig. 4 : Fault patterns in SMD and THT electrolytic capacitors: higher cavity pressures can lead to damage of the devices - Fig. 5 : High-viscosity materials may result in displacement of the capacitor and consequent damage during filling (PCB = printed circuit board) - Fig. 6 : The comparison of real and simulated process pressures during thermoset injection molding discloses significant deviations in the simulation En ligne : https://drive.google.com/file/d/1HGeP_mx9l8Mddx3yVgu1GHNWIUCkRkeN/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=36171 [article]

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