| Titre : |
Rediscovered component of hybrid parts : Leaktight overmolding with thermosets for high-performance applications |
| Type de document : |
texte imprimé |
| Auteurs : |
Marius Fedler, Auteur |
| Année de publication : |
2018 |
| Article en page(s) : |
p. 18-21 |
| Langues : |
Anglais (eng) |
| Catégories : |
Equipements électroniques ou électriques (EEE)
Matières plastiques -- Moulage par injection
Matières plastiques -- Surmoulage
Matières plastiques dans les équipements électriques et électroniques
Thermodurcissables
|
| Index. décimale : |
668.4 Plastiques, vinyles |
| Résumé : |
Technical thermoplastic materials have high thermal stability and outstanding electrical insulation properties, which is why they are already widely used in electrical applications. Where thermoplastics reach the limits of their performance, thermosets can offer an interesting alternative. The much debated disadvantage of the brittle fracture behavior can be avoided by skillfully joining them with thermoplastics in a 2-component part. |
| Note de contenu : |
- Overmolding with thermoplastic materials in electrical applications
- New ideas about the use of thermosets
- Thermoset hybrid parts with metals and thermoplastics
- Fig. 1 : Exterior dimensions and schematic view of an overmolded sensor. The comparison between BMC, EP and PBT shows the higher shrinkage values for thermoplastics compared to thermosets, resulting in higher loading of the inserts
- Fig. 2 : Trials with electronic modules : The conductor plate (dark green) was completely overmolded with plastic (translucent) to allow the performance to be definitively tested
- Fig. 3 : The interface between PPS and BMC shows an almost uniform profile, which is reflected in a very good bond strength of the joint parts
- Fig. 4 : Micrograph of a BMC thermoset (bulk molding compound, light) on a thermoplastic polyamide at the fracture point of a tensile bar,produce by the transfer process
- Fig. 5 : 2-component hybrid component with thermolastic insert and thermoset overmolding produced with the "DuroVerbund II" project for the definitive testing of bond strength and leak-tightness
- Fig. 6 : Bond strengths between a polyamide preform and the final overmolding with a phenolic resin, based on the strength of the phenolic resin solid bar in percent |
| En ligne : |
https://drive.google.com/file/d/1hiRYq1nhDGKrc3CNK8hx-CFN5I_QynXg/view?usp=drive [...] |
| Format de la ressource électronique : |
Pdf |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=30596 |
in KUNSTSTOFFE INTERNATIONAL > Vol. 108, N° 5 (05/2018) . - p. 18-21
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