Adhesives under pressure : How compressible are they ? / Holger Fricke in ADHESION - ADHESIVES + SEALANTS, N° 4/2010 (2010)  

[article]  inADHESION - ADHESIVES + SEALANTS > N° 4/2010 (2010) . - p. 36-38 Titre : Adhesives under pressure : How compressible are they ? Type de document : texte imprimé Auteurs : Holger Fricke, Auteur ; Manfred Peschka, Auteur Année de publication : 2010 Article en page(s) : p. 36-38 Langues : Multilingue (mul) Catégories : Colles:Adhésifs Compressibilité Epoxydes Essais dynamiques Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Quality assurance - The properties of bonded structure largely depend on the quality of the industrial bonding process. The latter comprises the conveying the adhesive from the drum, the pipe system, the dispensing, and the application of the adhesive bead. Whilst detailed knowledge about the mechanical properties of cured adhesives is readily available, relatively little known about the non-cured adhesives whilst they are being processed. Note de contenu : - Realistic estimation of the pressure decrease : Compact dispenser - Dispensing unit with dispenser on the robot upper arm and the outlet valve on the robot hand - Quantification of the compressibility - FIGURES : 1. Qualitative pressure profiles in a dispensing unit - 2. Test cell for measuring the compressibility of adhesives - 3. Compressibility of an epoxide adhesive at room temperature (23°C) En ligne : https://drive.google.com/file/d/1WFZXQO-OvbPEMA_ktd8RrjqW7GqFZf4N/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=25455 [article]

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Optimised processes without a major investment in testing / Manfred Peschka in ADHESION - ADHESIVES + SEALANTS, N° 4/2008 (04/2008)  

[article]  inADHESION - ADHESIVES + SEALANTS > N° 4/2008 (04/2008) . - p. 36-39 Titre : Optimised processes without a major investment in testing Type de document : texte imprimé Auteurs : Manfred Peschka, Auteur ; Holger Fricke, Auteur Année de publication : 2008 Article en page(s) : p. 36-39 Langues : Multilingue (mul) Catégories : Adhésifs -- Appareils et matériel Adhésifs -- Application-dosage Adhésifs thermofusibles Dynamique des fluides computationnelle Pompes à piston Rhéologie Simulation par ordinateur Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Simulation in adhesive manufacturing technology - Rationalised production processes are accompanied by a reduction in cycle times and a corresponding increase in the demands for reproducibility. In the case of adhesives, this applies to the processing speed and the increasing efficiency of the application procedure. One tool for optimising the application of adhesives in computational fluid dynamics simulation (CFD). This article describes the possibilities of this procedure and gives practical examples of its application. Note de contenu : - Optimising an applicaiton valve - The inside of a piston pump - Identifying effects and applying the results in practice - FIGURES : 1. The input and ouput figures for a computational fluid dynamics simulation of adhesive processing systems - 2. The cross-sectional model of a dispensing head for hotmelt adhesives and the resulting model of the area through which the fluid flows - 3 The flow pattern of the area through which the fluid flow indicates the limites for optimising the flow throughput of the dispensing head - 4. The cutaway model of a horizontal dispensing head shows the direction of flow reversing when the valve needle is closed (because the cylinder is symmetrical, only half of it is shown) - 5. Speed distribution inside a piston valve in a dual-action piston pump on the downstroke. En ligne : https://drive.google.com/file/d/1CA2kb_jOcZMWTc_XY_d8IEP19TzmK31J/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=25477 [article]

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Optimized heat dissipation of energy storage systems / Michael Frauenhofer in ADHESION - ADHESIVES + SEALANTS, Vol. 17, N° 3/2020 (2020)  

[article]  inADHESION - ADHESIVES + SEALANTS > Vol. 17, N° 3/2020 (2020) . - p. 12-17 Titre : Optimized heat dissipation of energy storage systems Type de document : texte imprimé Auteurs : Michael Frauenhofer, Auteur ; Marc Gormanns, Auteur ; Martin Simon, Auteur ; Martin Rütters, Auteur ; Holger Fricke, Auteur Année de publication : 2020 Article en page(s) : p. 12-17 Note générale : Bibliogr. Langues : Multilingue (mul) Catégories : Batteries électriques Dissipation d'énergie Energie thermique Thermocinétique Véhicules électriques Index. décimale : 668.3 Adhésifs et produits semblables Résumé : The quality of the heat dissipation from batteries towards the outer casinghas a strong impact on the performance and life on an electric vehicle. The heat conduction path between battery module and cooling system is realized in series production electric vehicles by measn of paste-like materials. These so-called gap fillers exhibit high thermal conductivity and specific mechanical properties. The aim of an ongoing BMWi research project is to develop a new generation of gap fillers with improved thermal conductivity and reduced density and to qualify them for use in series production. Note de contenu : - Significance of the gap filler - The OWES research project - Challenge in the formulation of gap fillers - Further development of ceramic fillers - Aluminum based fillers - Carbon based fillers - Carbon-AlOx hybrid based filler - Manufacturing properties - Simulation of squeezing flows - The squeeze flow experiment - Fluid structure interaction simulations - Simulation of the battery assembly process - Industrial use of the simulations - Fig. 1 : Before inserting the cell modules into the compartment floor, a heat-conducting gap filler is inserted - Fig. 2 : Cooperation in the OWES project - Fig. 3 : Influence of the degree of filling on density, thermal conductivity and viscosity on conventional materials (dashed) and improvement materials targeted in the project - Fig. 4 : Comparison of the thermal conductivities when replacing aluminium oxide by adding graphite and corresponding densities of the mixtures - Fig. 5 : The squeeze flow experiment is used to predict the force and the pressure when squeezing gap fillers - Fig. 6 : Simulation of a squeeze flow experiment on the bases of rheological data determined by a fluid structure simulation (FSI) - Fig. 7 : Experiment on the deflection of a metal sheet by the flow of a pink gap filler and comparison with the simulation - Fig. 8 : Comparison of experiment and simulation at component - Fig. 9 : Importance of the simulation of a complete component for industrial production En ligne : https://drive.google.com/file/d/1O6T29vV8_DaIcWyY49xdX5nEZYgs_x86/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=34643 [article]

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