| Titre : |
High temperature resistant tools and master models: seamless molding paste (SMP) technology |
| Type de document : |
texte imprimé |
| Auteurs : |
Philippe D. Christou, Auteur |
| Année de publication : |
2006 |
| Article en page(s) : |
p. 7-13 |
| Note générale : |
Bibliogr. |
| Langues : |
Américain (ame) |
| Index. décimale : |
668.4 Plastiques, vinyles |
| Résumé : |
This paper presents a new solution for making tools having resistance to high temperatures or to produce large master models of high quality surface. The standard method consisting of bonding and machining temperature resistant boards is time consuming and a major issue is that the bond lines lead frequently to surface defects on the final parts. An earlier approach involves a manual application of epoxy "patties". Such a process has not completely solved surface defect issues and is still costly a labor intensive.
Huntsman developed a solution based on seamless modeling paste (SMP) having a dual function: a machinable surface that is also adhesive between light weight structures. It is applied with conventional industrial equipment thus making the method tim effective, and above all, suitable for very large surface applications without any bond lines. Epoxy chemistry with latent and non latent hardeners give temperature resistance up to 200°C (HDT) after post-curing, and compressive strengths above 150 MPa.
After a description of the historical application processes and defects, this paper will present the new solution from an application and performance perspective. Chemical thixotropy concept, that is major contributor to the exceptional processability of this "hifh temperature resistant SMP", will also be discussed. |
| Note de contenu : |
- PROCESS CONSIDERATIONS : Processes descriptions and comparisons - Traditional process - "Patties" process - "High Temp" process
- MATERIAL CONSIDERATION : Material selection - Application parameters of SMP LMD2537/LMD2538 - Material characterization - Density - Hardness - Coefficient of thermal expansion (CTE) - Heat deflection temperature (HDT) - Compressive strength and modulus - Flexural strength - Linear shrinkage - Vacuum integrity - Material: performance/application relationship
- CHEMICAL THIXOTROPY CONCEPT |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=23442 |
in SAMPE JOURNAL > Vol. 42, N° 6 (11-12/2006) . - p. 7-13
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