| Titre : |
Effect of thermodynamics on filled moisture cure hot melts |
| Type de document : |
texte imprimé |
| Auteurs : |
H. T. Oien, Auteur |
| Année de publication : |
1996 |
| Article en page(s) : |
p. 30-33 |
| Note générale : |
Bibliogr. |
| Langues : |
Américain (ame) |
| Catégories : |
Adhésifs thermofusibles
Adhésion
Cristallisation
Pelage
Thermodynamique
|
| Index. décimale : |
668.3 Adhésifs et produits semblables |
| Résumé : |
For the type of reactive hot melt prepolymers discussed, there is a strong correlation between the heat of crystallization of the neat polymer and the 180° peel adhesion. The higher the ?H, the higher the expected 180° peel adhesion.
If a filler is needed, and for economic reasons it often is, choose one with a thermal conductivity close to or lower than that of the meat resin. The microspheres will accomplish this. The role the thermal conductivity of the fillers plays in the crystallization process is likely one of dissipating the heat generated through the heat of crystallization. A low thermal conductivity equates with a slower dissipation of the heat, thus allowing the crystalline network more time to orient itself on the substrate, or to better wet the substrate, resulting in higher peel values. |
| Note de contenu : |
- Fillers
- 180° peel adhesion. Sample preparation
- Crystallization profiles
|
| En ligne : |
https://drive.google.com/file/d/1rzih9Lzalhl0qRIsR4D9Zn_Q8nzDRkXE/view?usp=drive [...] |
| Format de la ressource électronique : |
Pdf |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=20485 |
in ADHESIVES AGE > Vol. 39, N° 2 (02/1996) . - p. 30-33
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