Titre : |
New solution acrylic PSAs for transfer tape applications |
Type de document : |
texte imprimé |
Auteurs : |
Eric Silverberg, Auteur |
Année de publication : |
2009 |
Article en page(s) : |
p. 28-31 |
Langues : |
Américain (ame) |
Catégories : |
Adhésifs sensibles à la pression Polyacryliques Polymères Rhéologie Rubans adhésifs Tackifiant (adhésifs)
|
Index. décimale : |
668.3 Adhésifs et produits semblables |
Résumé : |
The use of tackifiers in acrylic systems allows for better adhesion to low-surface-energy materials such as polyethylene and polypropylene. The covalent bond formed during crosslinking maintains strong cohesion properties despite the drop in storage modulus associated with formulation, which comes in contrast to traditional metal chelate systems. In addition to wide formulation latitude, these polymers have shown a tremendous range in glass-transition temperature (Tg), solubility parameters and functional group tolerance.
This article provides an introduction to the new technology and addresses how to achieve two-part performance in a one-part package. |
Note de contenu : |
TABLE : Base polymers made and general physical properties
FIGURES : 1. Aluminum Tris(acetylacetonate) and titanium dialkoxide bis(acetylacetonate) - 2. Example of hydroxyl functional PSA reacting with a Ddiisocyanate - 3. Acid and epoxy reaction - 4. Peel of a high-performance acrylic vs. base polymer A on various substrates - 5. Peel of a standard tackified grade vs. formulated polymers B and C - 6. Elevated temperature cohesive strength comparison - 7. Commercial grades vs. R&D grade on painted panels - 8. Typical rheological profile of base polymers vs. formulated adhesive - 9. Comparison of polymers D and E |
En ligne : |
http://www.adhesivesmag.com/articles/88081-new-solution-acrylic-psas-for-transfe [...] |
Format de la ressource électronique : |
Web |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=25902 |
in ADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 16, N° 7 (07-08/2009) . - p. 28-31