Titre : |
Adhesives under pressure : How compressible are they ? |
Type de document : |
texte imprimé |
Auteurs : |
Holger Fricke, Auteur ; Manfred Peschka, Auteur |
Année de publication : |
2010 |
Article en page(s) : |
p. 36-38 |
Langues : |
Multilingue (mul) |
Catégories : |
Colles:Adhésifs Compressibilité Epoxydes Essais dynamiques
|
Index. décimale : |
668.3 Adhésifs et produits semblables |
Résumé : |
Quality assurance - The properties of bonded structure largely depend on the quality of the industrial bonding process. The latter comprises the conveying the adhesive from the drum, the pipe system, the dispensing, and the application of the adhesive bead. Whilst detailed knowledge about the mechanical properties of cured adhesives is readily available, relatively little known about the non-cured adhesives whilst they are being processed. |
Note de contenu : |
- Realistic estimation of the pressure decrease : Compact dispenser - Dispensing unit with dispenser on the robot upper arm and the outlet valve on the robot hand
- Quantification of the compressibility
- FIGURES : 1. Qualitative pressure profiles in a dispensing unit - 2. Test cell for measuring the compressibility of adhesives - 3. Compressibility of an epoxide adhesive at room temperature (23°C) |
En ligne : |
https://drive.google.com/file/d/1WFZXQO-OvbPEMA_ktd8RrjqW7GqFZf4N/view?usp=drive [...] |
Format de la ressource électronique : |
Pdf |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=25455 |
in ADHESION - ADHESIVES + SEALANTS > N° 4/2010 (2010) . - p. 36-38