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Three-dimensional molded interconnect devices (3D-MID) / Jörg Franke / München [Germany] : Carl Hanser Verlag (2014)

Titre :	Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly and applications for injection molded circuit carriers
Type de document :	document électronique
Auteurs :	Jörg Franke, Editeur scientifique
Editeur :	München [Germany] : Carl Hanser Verlag
Année de publication :	2014
Importance :	XII-356 p.
Présentation :	ill.
Format :	24 cm
ISBN/ISSN/EAN :	978-3-446-43441-7
Prix :	200 E
Note générale :	Index - Bibliogr.
Langues :	Anglais (eng)
Catégories :	Assemblages (technologie) Composants moulés interconnectés Matières plastiques -- Moulage par injection Procédés de fabrication Structures tridimensionnelles
Index. décimale :	668.4 Plastiques, vinyles
Résumé :	This book provides a comprehensive overview about the current state of the technology 3D-MID along the whole process chain. Furthermore systematics about targeted development of MID parts are presented in own chapters each and the manifold fields of application of the MID technology are shown by means of more than a dozen successful MID-serial-applications.
Note de contenu :	- MID technology and mechatronic integration potential - Materials for 3D-MID - Structuring - Metallization - Assembly Technology for 3D-MID - Interconnection Technology - Quality and Reliability - MID Prototyping - Integrative Development of MID - Case Studies
Permalink :	https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=24661

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Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly and applications for injection molded circuit carriers

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