| Titre : |
Three-dimensional and with a fine structure : 3-D technology on the rise |
| Type de document : |
texte imprimé |
| Auteurs : |
Christian Goth, Auteur ; Thomas Kuhn, Auteur |
| Année de publication : |
2015 |
| Article en page(s) : |
p. 76-80 |
| Langues : |
Anglais (eng) |
| Index. décimale : |
668.4 Plastiques, vinyles |
| Résumé : |
Molded Interconnected Devices (MID) are three-dimensional electronic assemblies (3-D). Their strengths lie in the great freedom of design, the degree of miniaturization attainable and the resultant weight reduction as well as in integration of numerous functions. These mechatronic systems are used in a wide variety of applications such as automotive, industrial electronics, medical devices, telecommunications and sensor technology. |
| Note de contenu : |
- THE TECHNOLOGY
- EXAMPLES OF VOLUME APPLICATIONS: Position sensor for adaptive speed control - Optics carrier and heating element for caries diagnosis - Sensor carrier for a large-format camera
- MATERIAL DEVELOPMENTS : Heat-conducting thermoplastics - Plastics for the finest circuit traces - Materials for high thermal requirements during manufacturing and use - Injection moldable thermosets as LDS material |
| En ligne : |
https://drive.google.com/file/d/18R98r8jXH6g6Sar96VLUhxwaUtbZZ3Rr/view?usp=drive [...] |
| Format de la ressource électronique : |
Pdf |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=24546 |
in KUNSTSTOFFE INTERNATIONAL > Vol. 105, N° 6-7 (06-07/2015) . - p. 76-80
Aller sur edunet
Accueil
Three-dimensional and with a fine structure in KUNSTSTOFFE INTERNATIONAL, Vol. 105, N° 6-7 (06-07/2015)
