Dépouillements

Reliably reinforcing ball grid arrays while minimizing stress on solder joints / Markus Schindler in ADHESION - ADHESIVES + SEALANTS, Vol. 20, N° 2/2023 (2023)  

[article]  inADHESION - ADHESIVES + SEALANTS > Vol. 20, N° 2/2023 (2023) . - p. 13-16 Titre : Reliably reinforcing ball grid arrays while minimizing stress on solder joints Type de document : texte imprimé Auteurs : Markus Schindler, Auteur Année de publication : 2023 Article en page(s) : p. 13-16 Langues : Multilingue (mul) Catégories : Adhésifs dans les équipements électriques/électroniques Assemblages collés Bordures Circuits intégrés Index. décimale : 668.3 Adhésifs et produits semblables Résumé : No one likes stress. But stress is not just unpleasant for people ; it can also have negative effects on increasingly complex chip packages soldered onto circuit boards as integrated functinal units. Processes such as capillary underfill, corner fill, or edge bond are suitable for reinforcing these assemblies onto boards. Edge bond in particular is less likely to put stress on the component, extends the service life of the packages, and simplifies reworkability. Note de contenu : - First "Moore's law", now "more than moore" - Larger assemblies with increased functional density - Capillary underfill for reinforcing BGAs - Edge bond as a stress-free reinforcement - Corner fill as another option for reinforcing complex packages - Fig. 1 : Warpage of a package due to the difference in thermal length expansion of different materials - Fig. 2 : UV-curing edge bond on a test component and micrograph : edge bond only wets the flank and does not run under the package. No solder joint is bonded, which significantly simplifies any rework - Fig. 3 : Schematic of the test circuit where resistance is measured and the recorded measured resistance under stress (in this example, thermal shock) for several test setups - Fig. 4 : In the case of heat curing, the stress-free state of the adhesive is at the curing temperature (e.g., 100 °C), which means stresses are formed at room temperature and UV curing defines the stress-free state at room temperature - Fig. 5 : Edge bond, corner fill and capillary underfill. Three different reinforcement options for chip packages on boards. Areas where the adhesive is applied are marked in pink En ligne : https://drive.google.com/file/d/1b_F5OtDGyryUj_16v51AuPg0NXYhvQ5_/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=39389 [article]

Réservation

Réserver ce document

Exemplaires (1)

Code-barres	Cote	Support	Localisation	Section	Disponibilité
23963	-	Périodique	Bibliothèque principale	Documentaires	Disponible

Sustainable solvents for polychloroprene-based contact adhesives / Martin Schneider in ADHESION - ADHESIVES + SEALANTS, Vol. 20, N° 2/2023 (2023)  

[article]  inADHESION - ADHESIVES + SEALANTS > Vol. 20, N° 2/2023 (2023) . - p. 18-21 Titre : Sustainable solvents for polychloroprene-based contact adhesives Type de document : texte imprimé Auteurs : Martin Schneider, Auteur ; Rainer Kalkofen, Auteur ; Kevin Kulbaba, Auteur Année de publication : 2023 Article en page(s) : p. 18-21 Note générale : Bibliogr. Langues : Multilingue (mul) Catégories : Colles:Adhésifs Formulation (Génie chimique) Polychloroprène Solvants écologiques Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Key characteristic of polychloroprene-based solvent borne contact adhesives is their convenient handiing and use due to the immediate and high initial strength of the bond which is formed. The use of crude oil-based solvents in these adhesives is still considered state-of-the art but is no longer desirable for reasons of sustainability. By choosing the appropriate bio-based solvents for polychloroprene contact adhesives, conventional solvent systems can be replaced by sustainable alternatives. Note de contenu : - Polychloroprene as base material for contact adhesives - Benefits of solvent-based contact adhesives - Choice of bio-based solvent - Base formulation for the investigation - Solubility, stability, and viscosity - Long contact bonding times and high final strength - Table : 1 Properties of selected bio-based solvents - Table 2 : Base formulation En ligne : https://drive.google.com/file/d/1lYCCxfvZawybhHeGnBBqJrQIvKZWPl7I/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=39390 [article]

Réservation

Réserver ce document

Exemplaires (1)

Code-barres	Cote	Support	Localisation	Section	Disponibilité
23963	-	Périodique	Bibliothèque principale	Documentaires	Disponible

Epoxy resin as a risk for the respiratory tract / Denis Beisch in ADHESION - ADHESIVES + SEALANTS, Vol. 20, N° 2/2023 (2023)  

[article]  inADHESION - ADHESIVES + SEALANTS > Vol. 20, N° 2/2023 (2023) . - p. 22-24 Titre : Epoxy resin as a risk for the respiratory tract Type de document : texte imprimé Auteurs : Denis Beisch, Auteur Année de publication : 2023 Article en page(s) : p. 22-24 Note générale : Bibliogr. Langues : Multilingue (mul) Catégories : Appareils de protection respiratoire Epoxydes Produits chimiques -- Toxicologie Respirateurs Travailleurs -- Protection Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Epoxy resins are real all-rounders. This is mainly due to the highly functional technical properties that make the synthetic resin a versatile construction adhesive, for example. At the same time, epoxy resins are the reason for occupational allergic skin disorder and, without the necessary protective measures, also endanger the respiratory tract. Which protection is best for your own application depends on a number of factors. Note de contenu : - Prerequisites for working with epoxy resin - Blower-assisted respiratory protection - Selecting the right air purifying respirator - Medical evaluation for respirator usage - Service life of respiratory filters - Table : Which protection is needed for which contaminant En ligne : https://drive.google.com/file/d/1UsAeEUbNvLKelaFNSfCRRJsacvAM0jaI/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=39391 [article]

Réservation

Réserver ce document

Exemplaires (1)

Code-barres	Cote	Support	Localisation	Section	Disponibilité
23963	-	Périodique	Bibliothèque principale	Documentaires	Disponible

Green deal challenge : adhesive as problem solvers in the packaging industry / Kresimir Cule in ADHESION - ADHESIVES + SEALANTS, Vol. 20, N° 2/2023 (2023)  

[article]  inADHESION - ADHESIVES + SEALANTS > Vol. 20, N° 2/2023 (2023) . - p. 26-29 Titre : Green deal challenge : adhesive as problem solvers in the packaging industry Type de document : texte imprimé Auteurs : Kresimir Cule, Auteur Année de publication : 2023 Article en page(s) : p. 26-29 Langues : Multilingue (mul) Catégories : Adhésifs -- Emballages Adhésifs en phase aqueuse Durée de vie (Ingénierie) Polyéthylène téréphtalate Recyclabilité Stratifiés Structures multicouches Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Adhesives are used in multi-layer packaging systems to combine various functional materials. They may, in the future, play a significant role when it comes to the development of sustainable and recyclable packaging systems. What matters above all is that all parties involved in a product's life cycle work together within the value chain. Note de contenu : - The green deal - a challenge for the packaging industry - Sustainability through the reduction of carbon emissions - Sustainability through water-based raw material - The main enefits of water-based lamination adhesives - Sustainability through development of new adhesive products - Debonding - Paper trays - Compostable packaging - Barrier for mono-material - Chemcycling - Fig. 1 : A bag of potato chips - an example to illustrate the structure of multi-layer packaging - Fig. 2 : 2 Cheese packaging - an example to illustrate the structure of multi-layer items - Fig. 3 : An essential component of the Green Deal concept stipulates that, as of 2030, packaging must reach a certain minimum level of recyclability throughout the EU - Fig. 4 : The bio-mass balance approach and how it works - Fig. 5 : The steps in packaging production: intermediate storage (warehouse) required to ensure complete curing of adhesives is no longer necessary ; products can therefore be processed straight afterwards - Fig. 6 : Water-based adhesive systems: The diagram shows peel strength as a function of time. It only takes two hours until the water-based system has reached the required peel strength of 5 Newtons (N) per 15 millimeters - Fig. 8 : Closed recycling loop for PET-based multi-layer packaging En ligne : https://drive.google.com/file/d/17nDSMz_2ie1J2fdOUcT6MtRiBqV9TIGK/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=39392 [article]

Réservation

Réserver ce document

Exemplaires (1)

Code-barres	Cote	Support	Localisation	Section	Disponibilité
23963	-	Périodique	Bibliothèque principale	Documentaires	Disponible

Stresses in the adhesive joint after curing / Jana Kolbe in ADHESION - ADHESIVES + SEALANTS, Vol. 20, N° 2/2023 (2023)  

[article]  inADHESION - ADHESIVES + SEALANTS > Vol. 20, N° 2/2023 (2023) . - p. 30-34 Titre : Stresses in the adhesive joint after curing Type de document : texte imprimé Auteurs : Jana Kolbe, Auteur ; Christoph Nagel, Auteur Année de publication : 2023 Article en page(s) : p. 30-34 Langues : Multilingue (mul) Catégories : Adhésifs -- Séchage Bisphénol A Dilatométrie Flexion (mécanique) Mesure Réactions chimiques Réticulants Index. décimale : 668.3 Adhésifs et produits semblables Résumé : During setting of adhesives, there is a volume decrease which can lead to undesirable stresses in the bonded joint. For many applications, these stresses are simulated in the design period in order to optimise the bonded joint. But how high is the volume reduction that has to be taken into account ? Note de contenu : - Volume reduction of the adhesive - Experimental determination of the volume change via the density difference - Determination of volume change by means of a mercury dilatometer - Determination of volume change with the bending beam method - Conversion during adhesive curing - Fig. 1 : Reaction between epoxidized bisphenol A and an amine hardener - Fig. 2 : Schematic structure of a mercury dilatometer - Fig. 3 : Principle of a shrinkage bending beam measurement - Table 1 : Bond length for different atomic bonds ; pm = 10-12 m - Table 2 : Volume change using the shrinkage bending beam method - elasticity constants E = 70000 MPa (substrate) and 2280 MPa (layer) En ligne : https://drive.google.com/file/d/1W29lCNdoK0cL9wtzkwCRyQoF1mBA04_g/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=39393 [article]

Réservation

Réserver ce document

Exemplaires (1)

Code-barres	Cote	Support	Localisation	Section	Disponibilité
23963	-	Périodique	Bibliothèque principale	Documentaires	Disponible