Titre : |
Influence of polyol unsaturation on urethane properties |
Type de document : |
texte imprimé |
Auteurs : |
Thomas Fishback, Auteur ; Gladys Aviles, Auteur ; Curt Reichel, Auteur |
Année de publication : |
1996 |
Article en page(s) : |
p. 20-23 |
Note générale : |
Bibliogr. |
Langues : |
Américain (ame) |
Catégories : |
Adhésifs en phase aqueuse Elastomères Formulation (Génie chimique) Poids moléculaires Polyols Polyuréthanes Résistance aux conditions climatiques Rhéologie Viscosité
|
Index. décimale : |
668.3 Adhésifs et produits semblables |
Résumé : |
The reduction of unsaturation in polyols used in the production of elastomeric urethane materials provides improved physical properties and environmental resistance. Diols must possess very low levels of unsaturation to be of practical benefit. In triols, even a partial reduction (50%) in unsaturation results in noticeable gains in sealant properties. Reduction of triol unsaturation to low levels provides even further gains. The combination of high molecular weight, low unsaturation triols and diols gives tough, highly extendible materials which perhaps will be competitive with silicones in the 50% movement capability sealant market. Commercialization of propylene oxide-based diols with very low unsaturation will provide a new tool for formulators. Formulators will be able to incorporate a higher molecular weight soft segment than was previously possible in elastomers. The weatherability of urethane products will benefit from the increased retention of elastomeric properties provided by polyols with lower unsaturation content. |
Note de contenu : |
- EXPERIMENTAL SEALANTS
- ELASTOMERS
- FILMS
- RESULTS AND DISCUSSION : Sealants - Elastomers - Films
- ENVIRONMENTAL RESISTANCE |
En ligne : |
https://drive.google.com/file/d/1vWx_Ar2I292-MGe-0w0IPI7rIxmPZMLy/view?usp=drive [...] |
Format de la ressource électronique : |
Pdf |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=20503 |
in ADHESIVES AGE > Vol. 39, N° 7 (06/1996) . - p. 20-23