| Titre : |
Direct packaging of components : Thermoset injection molding of packages for electronic devices |
| Type de document : |
texte imprimé |
| Auteurs : |
Torsten Maenz, Auteur ; Martin Giersbeck, Auteur ; Gerrit Hülder, Auteur ; Armin Kech, Auteur |
| Année de publication : |
2021 |
| Article en page(s) : |
p. 12-16 |
| Langues : |
Anglais (eng) |
| Catégories : |
Emballages en matières plastiques
Equipements électroniques ou électriques (EEE)
Matières plastiques -- Moulage par injection
Matières plastiques -- Surmoulage
Thermodurcissables
|
| Index. décimale : |
668.4 Plastiques, vinyles |
| Résumé : |
Thermosets are being increasingly used for packaging electronic devices, and offer good properties for this application. Direct overmolding of the components is particularly interesting here. However, achieving a successful product requires striking a balance between processability, thermal conductivity and reproducibility. |
| Note de contenu : |
- More gentle processing compared to thermoplastics
- Special features of the filling behavior
- Power loss and thermal conductivity not proportional
- Failures with to high cavity pressure
- Differences between simulation and reality
- Figure : In direct packaging, the electronic devices or components are directly overmolded with the molding compound
- Fig. 1 : Thermal conductivity depending on the flow direction for different sheet thicknesses: with increasing sheet thickness, the thermal conductivity decreases in the x-direction and increases in the z-direction
- Fig. 2 : Thermal conductivity (left) and power consumption (right; with/without convection) for 2 mm thick sheets of different thermoset molding compounds: the thermal conductivity and power consumption of the materials increase disproportionately to one another
- Fig. 3 : Comparison of the cavity pressures for materials with lower (left) and higher (right) viscosity: at lower viscosity, the cavity pressure is significantly lower
- Fig. 4 : Fault patterns in SMD and THT electrolytic capacitors: higher cavity pressures can lead to damage of the devices
- Fig. 5 : High-viscosity materials may result in displacement of the capacitor and consequent damage during filling (PCB = printed circuit board)
- Fig. 6 : The comparison of real and simulated process pressures during thermoset injection molding discloses significant deviations in the simulation |
| En ligne : |
https://drive.google.com/file/d/1HGeP_mx9l8Mddx3yVgu1GHNWIUCkRkeN/view?usp=drive [...] |
| Format de la ressource électronique : |
Pdf |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=36171 |
in KUNSTSTOFFE INTERNATIONAL > Vol. 111, N° 6 (2021) . - p. 12-16
Aller sur edunet
Accueil
Ajouter le résultat dans votre panier Affiner la rechercheVirtual component development / Martin Giersbeck in KUNSTSTOFFE INTERNATIONAL, Vol. 101, N° 7 (07/2011)
