| Titre : |
Adhesives to die for : Die development for fiberization of high-performance adhesives |
| Type de document : |
texte imprimé |
| Auteurs : |
Rick J. Klaus, Auteur |
| Année de publication : |
2001 |
| Article en page(s) : |
p. 33-34 |
| Note générale : |
Bibliogr. |
| Langues : |
Américain (ame) |
| Catégories : |
Colles:Adhésifs
Matières premières
Polymères
|
| Tags : |
'Adhésifs hautes performances' |
| Index. décimale : |
668.3 Adhésifs et produits semblables |
| Résumé : |
WHEN product designers are considering the use of high-performance adhesives, the challenge has always been to define the correct adhesive application method that will work. Numerous papers and studies have been written and conducted over the last 45 years concerning die design and fluid flow characteristics. The purpose of this article is to review the basic types of existing die geometries as well as newly developed geometry for use with various high performance adhesives and resins. Fiberization of these materials requires good control of cross web uniformity and residence time as well as shear history. This article will not get into the mathematical proofs of which die design is better for a given fluid, but instead concentrate on the types of dies available and the flow aspects associated with them.
Dies are widely used in the coating and lamination industry for applying a broad range of thermoplastic products, using both contact and non-contact methods. This article looks at dies for use with fiberization spinpack assemblies. Most dies can handle typical pressure-sensitive adhesives and EVA with little difficulty, as evidenced by the large number of them in operation.
Despite the wide-spread use, the selection of die designs for high performance adhesives and resins has always been a source of argument due to the narrower operating window of these materials.
Typical adhesives that have been considered to be high performance in nature can be broken down as shown in Table I. While this listing does not cover the full breadth of adhesives available, it does highlight the major categories being considered for use by most manufacturers. The common aspect of these materials is the higher processing temperature requirements. By taking a look at the type of die designs currently available, and applying a decision matrix, one can make a decision one what technology best fits their needs. |
| En ligne : |
https://drive.google.com/file/d/1keisCvJSMAvXJUzgMSQN5qY-rOJSie0I/view?usp=drive [...] |
| Format de la ressource électronique : |
Pdf |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19746 |
in ADHESIVES AGE > Vol. 44, N° 2 (02/2001) . - p. 33-34
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Adhesives to die for in ADHESIVES AGE, Vol. 44, N° 2 (02/2001)
