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Designing rebondable structural adhesives / Jacob Meyer in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 26, N° 9 (09/2019)  

[article]  inADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 26, N° 9 (09/2019) . - p. 16-19 Titre : Designing rebondable structural adhesives : Aromatic thermosetting polyesters have been shown to be fully compatible with the reversible bonding adhesion concept Type de document : texte imprimé Auteurs : Jacob Meyer, Auteur ; Zeba Parkar, Auteur Année de publication : 2019 Article en page(s) : p. 16-19 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Adhésifs structuraux Adhésion réversible Aramides Les polyamides aromatiques, ou aramides, sont une classe de matériaux résistant à la chaleur et/ou présentant de bonnes propriétés mécaniques. Ils ne peuvent être utilisés que comme fibres, qui servent surtout à la fabrication de matériaux composites, en renfort de matrices. Le mot-valise "aramide" vient de la contraction de l'anglais aromatic polyamide. Les fibres sont obtenues par filage (étirage au travers d'une filière) à partir d'une dissolution. Les chaînes moléculaires sont fortement orientées dans le sens de l'axe de la fibre, de sorte que les forces des interactions moléculaires peuvent être exploitées pour la résistance thermique et/ou mécanique. Assemblages collés Composés aromatiques Polyesters Thermodurcissables Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Reversible adhesion inspired by the gecko has attracted attention in applications such as biomedical masks, climbing robots, transfer printing, and pressure-sensitive adhesives. The approaches used to accomplish reversible adhesion are typically classed into two categories: patterned and non-patterned. The first category uses a micro-patterned surface that mimics well-known biostructures, while the latter category does not. The adhesion force between the surfaces is generated from contributions by Van der Waals, capillary, mechanical interlocking, covalent bonding, and hydrogen bonding. Greater compliance/conformability can be achieved by the patterned surfaces, allowing these adhesives to exhibit better adhesion than their non-patterned counterparts. This approach has been extensively studied in academia but has not found widespread use in industry. Note de contenu : - Seeking reworkability : Reworkable adhesives include - Incorporating aromatic thermosetting polyesters - Exploring in-space assembly - Figure : Cohesive failure En ligne : https://www.adhesivesmag.com/articles/97185-designing-rebondable-structural-adhe [...] Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=33217 [article]

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Using novel emulsion-based PSAs in high-performance applications / Yang Park in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 26, N° 9 (09/2019)  

[article]  inADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 26, N° 9 (09/2019) . - p. 20-23 Titre : Using novel emulsion-based PSAs in high-performance applications : New pressure-sensitive adhesives have been developed that can rival existing solvent acrylic and radiation-curable technologies used in high-performance tape and label applications. Type de document : texte imprimé Auteurs : Yang Park, Auteur Année de publication : 2019 Article en page(s) : p. 20-23 Langues : Américain (ame) Catégories : Adhésifs en phase aqueuse Adhésifs sensibles à la pression Etiquettes Polyacryliques Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Pressure-sensitive adhesives (PSAs) have become more popular in demanding tape and label applications. Many high-performance PSA applications are dominated by solvent acrylic PSAs and radiation-curable PSAs because they can achieve much higher cohesive strength and heat resistance than other technologies, including typical emulsion PSAs. Due to these performance limitations, waterborne emulsion PSAs are used in less demanding applications. Waterborne acrylic PSAs provide many advantages such as high solids, lower cost, low hazard, and environmental benefits. With these advantages, industry has been pushing the limits of emulsion technologies to close the performance gaps between emulsion and other high-performance technologies. A new waterborne technology with excellent adhesion and high-temperature properties has been developed that can rival existing solvent acrylic and radiation-curable technologies that are currently used in high-performance applications. The high temperature resistance is measured by shear adhesion failure temperature (SAFT; PSTC-17 test method), which has been the biggest limitation of waterborne PSAs vs. radiation-curable and solvent acrylic PSAs. Note de contenu : - Adhesive properties - Waterborne emulsion PSA - Low-surface-energy emulsion PSA - Possible applications - Future development - Fig. 1 : Comparison of the new emulsion PSA vs. syrup UV and solvent PSA - Fig. 2 : Peel adhesion comparison on various substrates (90° peel with 72-hr dwell) - Fig. 3 : Comparison of fluid immersion test (90° peel with 7-day dwell) - Fig. 4 : Chemical resistance and temperature cycling (90° peel with 7-day dwell) - Fig. 5 : Comparison of the new LSE prototype PSA vs. syrup UV LSE PSA - Fig. 6 : Peel adhesion on various substrates (90° peel with 72-hr dwell) - Fig. 7 : Peel adhesion of fluid immersion test (90° peel with 7-day dwell) - Fig. 8 : Chemical resistance and temperature cycling (90° peel with 7-day dwell) En ligne : https://www.adhesivesmag.com/articles/97199-using-novel-emulsion-based-pressure- [...] Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=33218 [article]

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UV and LED technologies for adhesive applications / Chris Davis in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 26, N° 9 (09/2019)  

[article]  inADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 26, N° 9 (09/2019) . - p. 30-32 Titre : UV and LED technologies for adhesive applications : Adhesives are cured right away using UV/LED technologies, so the parts or converted materials are immediatly ready for the next downstream process Type de document : texte imprimé Auteurs : Chris Davis, Auteur Année de publication : 2019 Article en page(s) : p. 30-32 Langues : Américain (ame) Catégories : Adhésifs -- Séchage sous rayonnement ultraviolet Adhésifs thermofusibles Assemblages collés Diodes électroluminescentes Photoréticulation Index. décimale : 668.3 Adhésifs et produits semblables Résumé : As adhesives become more prevalent and accepted in industry, the more varied the formulations have become—and by corollary, the more diverse the curing mechanisms. One curing method that has gained traction is radiation curing—specifically, using the ultraviolet (UV) spectrum to provide photonic energy that triggers a fast reaction called photopolymerization. In this particular case, the adhesives contain a photo initiator, which, when exposed to UV light, generates a reactive species that starts to create C-C bonds; the higher the percentage of C-C bonds, the better the "cure". Note de contenu : - Understanding UV and LED - Practical examples - Determining feasibility - Fig. 1 : The UV spectrum - Fig. 2 : High-intensity energy can be used to transmit the dose to the adhesive if the adhesive is under a layer of transparent material - Fig. 3 : In the case of hot-melt UV acrylate adhesives, the dose is monitored with a highly accurate sensor and is linked into the UV system's power setting to create a closed-loop power control En ligne : https://www.adhesivesmag.com/articles/97194-uv-and-led-technologies-for-adhesive [...] Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=33219 [article]

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Adhesives & sealants industry Vol. 26, N° 9 URL