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Novel technology for non-silicone, non-solvent-based release coatings / Joel Erwin Goldstein in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 24, N° 5 (05/2017)
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Titre : Novel technology for non-silicone, non-solvent-based release coatings Type de document : texte imprimé Auteurs : Joel Erwin Goldstein, Auteur Année de publication : 2017 Article en page(s) : p. 17-19 Langues : Américain (ame) Catégories : Etiquettes
Hydrophobie
Polyvinyle octadécyle carbamate
Résistance au vieillissement
Résistance thermique
Revêtements anti-adhésion
Rubans adhésifsIndex. décimale : 668.3 Adhésifs et produits semblables Résumé : Based on a novel monomer, the release polymer has already proven successful in applications for film tapes. Offering strong hydrophobic performance, contamination resistance, and heat and aging resistance, it eliminates the need for silicone in end use, resulting in a completely repulpable product. Additionally, it offers the ability to reduce the environmental risks and burdens imposed by solvents or fluorine-based products.
This polymer can be blended with other products, such as those shown in Figure 5, enabling the creation of unique release coating formulations for specific applications. Work is ongoing to leverage this new technology for more applications, widening the range of release strengths it can provide and further enabling the reduction and elimination of older technologies, allowing more environmentally preferred end use products to be developed.Note de contenu : - Hydrophobicity
- Contamination
- Resistance to heat and aging
- FIGURES : 1. Water bead up on a coated and uncoated substrate - 2. Contact angle of water on a film made from the release polymer and a siliconized release liner - 3. Contamination resistance comparison - 4. Aged adhesion of the release polymer to backing, 12 in./min. - 5. Adhesion to backing, 600 in./min.
- TABLE : Test resultsEn ligne : http://www.adhesivesmag.com/articles/95457-novel-technology-for-non-silicone-non [...] Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=28639
in ADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 24, N° 5 (05/2017) . - p. 17-19[article]Réservation
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Titre : A natural choice : Cashew nutshell liquid-based epoxy curing agents and polyols offer outstanding performances and benefits for adhesives and sealants Type de document : texte imprimé Auteurs : Yun mi Kim, Auteur ; James Zhao, Auteur ; William Wei, Auteur Année de publication : 2017 Article en page(s) : p. 21-25 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Anticorrosion
Cardanol
Colles:Adhésifs
Diols
Epoxydes
Joints d'étanchéité
Noix de cajou et constituants
Phénalkamides
Phénalkamines
Polyols
Résistance à l'humidité:Résistance à l'eau
Résistance chimique
Ressources renouvelables
RéticulantsIndex. décimale : 668.3 Adhésifs et produits semblables Résumé : Cashew nutshell liquid (CNSL), a bio-renewable resource found in the honeycomb structure of the cashew nutshell, is considered a byproduct of the cashew industry. Therefore, CNSL is a non-food chain product that would otherwise be disposed of. Cashew trees can grow abundantly in tropical conditions.
One of the most commercially useful chemicals from CNSL is cardanol, a pentadecadienyl phenol with an aliphatic side chain that usually consists of a mixture of one, two, and three double bonds in a linear chain. This natural phenolic compound has interesting chemical structural features that enable a variety of chemical modifications to create bio-based monomers and polymers. Phenalkamine is one of most successful chemicals used in cashew nutshell liquid, along with phenalkamide, exhibiting good reactivity for fast and low-temperature cure and strong adhesion even to damp or poorly prepared surfaces. In addition, its long aliphatic side chain delivers excellent water resistance, corrosion protection and chemical resistance.Note de contenu : - Phenalkamines
- Phenalkamides
- CNSL polyols
- CNSL diols
- TABLES : 1. Tested curing agents, phenalkamines, phenalkamides, and reference curing agent - 2. Tested polyols and diols - 3. Mechanical properties of phenalkamines and the reference - 4. Performance comparison of phenalkamides - 5. Physical properties of polyols cured with polymeric MDI (P-MDI) - 6. Compatibility oc CNSL diols compared to PolyBDEn ligne : http://www.adhesivesmag.com/articles/95456-a-natural-choice-for-adhesives-and-se [...] Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=28640
in ADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 24, N° 5 (05/2017) . - p. 21-25[article]Réservation
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