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New uses for water-based PSAs / John Ouyang in ADHESIVES AGE, Vol. 45, N° 3 (03/2002)  

[article]  inADHESIVES AGE > Vol. 45, N° 3 (03/2002) . - p. 22-24 Titre : New uses for water-based PSAs : Formulations based on acrylic latex and polyurethane dispersion created for graphic labels and tapes Type de document : texte imprimé Auteurs : John Ouyang, Auteur ; Solomon Jacobson, Auteur ; Lilly Shen, Auteur ; Scott Reedell, Auteur Année de publication : 2002 Article en page(s) : p. 22-24 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Adhésifs en phase aqueuse Adhésifs sensibles à la pression Dispersions et suspensions Dynamique moléculaire Etiquettes Latex pH Polyacryliques Résistance au cisaillement Rubans adhésifs Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Observed viscosity increase and high-shear resistance at high pH for anionic polyurethane (78-6625)/acrylic might be due to stronger molecular interactions. Molecular modeling calculations showed stronger molecular interactions between the acrylic polymer and anionic polyurethane at higher pH. The calculation also revealed slightly weaker molecular interactions between the acrylic polymer and nonionic polyurethane (Luphen D259U) when the pH increases. Comparison of results obtained for polyurethane with different stabilizing mechanisms suggested that molecular interactions could be useful for predicting blend stability and adhesion performance. En ligne : https://drive.google.com/file/d/1lnJq-9jcpLV8QjaLIZaLZyqTgMr7B7m3/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19991 [article]

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Beat the heat / N. Julian K. Danvers in ADHESIVES AGE, Vol. 45, N° 3 (03/2002)  

[article]  inADHESIVES AGE > Vol. 45, N° 3 (03/2002) . - p. s4-s7 Titre : Beat the heat : New challenges for curing material on heat-sensitive substrates Type de document : texte imprimé Auteurs : N. Julian K. Danvers, Auteur Année de publication : 2002 Article en page(s) : p. s4-s7 Langues : Américain (ame) Catégories : Adhésifs -- Séchage sous rayonnement électronique Adhésifs -- Séchage sous rayonnement ultraviolet Coût de production Entretien et réparations Micro-ondes Réticulation (polymérisation) Index. décimale : 668.3 Adhésifs et produits semblables Résumé : While the lamp head in itself is the primary generator for the heat, this article has tried to demonstrate the factors and technology available in this area to deal with this issue. The exact system used depends on the type and scale of application. Microwave technology has particular advantage in powder, fiber optic, hard coat and plastic component applications. A water-filtered lamp here is better suited to webstyle processes. There is a significant overlap between the suitability of UV sources for different applications. Some of the processes involved can be complex. For example, when curing a coating onto pine, heat is a major issue due to sap rising from the wood and damaging the coating. A recent case has seen electrode technology removed in favor of the lower heat and high intensities associated with microwave. With a three-dimensional object, the short length on a microwave system becomes a major advantage when trying to cover the whole surface with an even UV dose. Automotive headlights generally use a three-lamp arrangement to achieve this result. When dealing with large sheets or webs, a water-cooled or filtered system becomes more advantageous due to the continuous span. For example, the printing of a bank note onto either paper or plastic will use this style technology. The choice of lamp head is a complex issue and the factors affecting the design chosen are not straightforward as it is in a trade-off situation. What I have aimed to do is highlight the area that needs to be considered to enable the reader to better judge the situation. Note de contenu : - Reflector Technologies - Focus, UV Intensity & Aspect Ratio - Operational Differences - Maintenance & Operating Costs En ligne : https://drive.google.com/file/d/1RXonadhnfSTnMruk10x7emcXrqshSXP3/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19992 [article]

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Light curing cyanoacrylates / Patrick J. Courtney in ADHESIVES AGE, Vol. 45, N° 3 (03/2002)  

[article]  inADHESIVES AGE > Vol. 45, N° 3 (03/2002) . - p. s8-s11 Titre : Light curing cyanoacrylates : Innovative adhesive technology for high speed manufacturing Type de document : texte imprimé Auteurs : Patrick J. Courtney, Auteur Année de publication : 2002 Article en page(s) : p. s8-s11 Langues : Américain (ame) Catégories : Colles:Adhésifs Cyanoacrylates Photoréticulation Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Light-curing cyanoacrylate adhesives offer processing and performance benefits for high speed assembly processes. These one-part, solven-free systems offer rapid cure of exposed and confined adhesive on bond joints without requiring the use of heat or racking of parts. Their processing characteristics allow manufacturers the rapid cure speed benefits of light curing acrylic adhesives with the ease of use and reliability of the cyanoacrylate secondary cure mechanism. Since they are based on cyanoacrylate chemistry, these adhesives offer the high-bond strenght to a wide variety of substrates that can be expected from a cyanoacrylate. This combination of high performance with guaranteed complete cure offers manufacturers the ability to improve the robustness, output and performance of their bonding operations. Note de contenu : - Processing limitations addressed by light-curing cyanoacrylate adhesive - Light-cure acrylic limitations addressed by light-curing cyanoacrylates - Curing properties tack free time typical applications En ligne : https://drive.google.com/file/d/1BvfmCH2HB55MwUx9wCG8X-yyiBlnCvQp/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19993 [article]

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Big things in small packages / Sabine Herold in ADHESIVES AGE, Vol. 45, N° 3 (03/2002)  

[article]  inADHESIVES AGE > Vol. 45, N° 3 (03/2002) . - p. s12-s14 Titre : Big things in small packages : New adhesives provide opportunities in the electronics market Type de document : texte imprimé Auteurs : Sabine Herold, Auteur Année de publication : 2002 Article en page(s) : p. s12-s14 Langues : Américain (ame) Catégories : Adhésifs -- Séchage sous rayonnement ultraviolet Collage Colles:Adhésifs Electronique -- Matériaux Epoxydes Photoamorceurs (chimie) Photoréticulation Polyacrylates Réticulation (polymérisation) Index. décimale : 668.3 Adhésifs et produits semblables Résumé : The joining technique "bonding" has become more and more important in electronics. The reason for this is the trend towards miniaturization of modules, structural components and end products. The task of bonding very different materials onto a minimum of space securely, permanently and economically makes the usage of classical joining techniques, such as screwing, riveting or welding, nearly impossible. The adhesive, however, which is optimally adjusted to the application, is ideal. Due to the globalization of markets and the trend towards outsourcing, the image of modern production firms is dominated more and more by industrial mass production. This leads towards the demand for adhesive applications to be served by products that enable mass production with very short cycle times. Photo-initiated adhesives fulfill this requirement perfectly. Recently, significant successes have been achieved in the development of light-curing acrylates and light-activated epoxies. These products are particularly suitable for industrial production applications, where their rapid curing characteristics allow short cycle times. At the same time, these materials meet the increasing requirements of the electronics industry for electrical and thermal properties as well as chemical and corrosion resistance. Additionally, initiation with radiation in the visible spectrum allows the curing of these materials in applications where it needs to be cured through transparent plastics, such as PMMA, PC or PVC. Due to the absorption of ultraviolet radiation by such plastics, this cannot usually be achieved by standard UV-curing adhesives. Different adhesive systems with their curing mechanisms and characteristics will be introduced. By comparing different development stages, the outstanding properties of the latest generation of these adhesives are seen. By way of several examples, the possibilities of commercial mass production in the electronics industry can be demonstrated. As a result of research and development activities, products can be offered which have, apart from the features mentioned previously, good adhesive and cohesive strenght together with high flexibility. Note de contenu : - Photo-initiated adhesives - Embedding of coils - Miniature loudspeakers for cellular phones - Relais-sealing En ligne : https://drive.google.com/file/d/1WdnpKEgH6f-A9Ms0tYC_x_eiX_UmK_xX/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19994 [article]

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Technology flexes its muscles / Stephen C. Lapin in ADHESIVES AGE, Vol. 45, N° 3 (03/2002)  

[article]  inADHESIVES AGE > Vol. 45, N° 3 (03/2002) . - p. s15-s17 Titre : Technology flexes its muscles : The hottest trends in electron beam curable laminating adhesives for flexible packaging Type de document : texte imprimé Auteurs : Stephen C. Lapin, Auteur Année de publication : 2002 Article en page(s) : p. s15-s17 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Adhésifs -- Séchage sous rayonnement électronique Aliments -- Emballages Emballages Plan d'expérience Stratifiés Index. décimale : 668.3 Adhésifs et produits semblables Résumé : DOE techniques were very useful for the development of EB curable laminating adhesives. Contour plots and trend analysis were used to elucidate the effect of each adhesive component on bond strengths. Optimized compositions were identified for individual film structures. Simultaneous optimization was also used to identify the best overall adhesive for a range of film structures. The resulting adhesive appears to have properties that are attractive for many flexible packaging applications. En ligne : https://drive.google.com/file/d/1pYoZssRL-W6BgaW6z5lRyvELwewpt3fQ/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19995 [article]

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Seeing the light / Greg Bachmaan in ADHESIVES AGE, Vol. 45, N° 3 (03/2002)  

[article]  inADHESIVES AGE > Vol. 45, N° 3 (03/2002) . - p. 25-29 Titre : Seeing the light : New UV light lamp provides efficient curing of adhesives Type de document : texte imprimé Auteurs : Greg Bachmaan, Auteur ; Herman Reiss, Auteur ; John Black, Auteur ; Kevin St. Georges, Auteur Année de publication : 2002 Article en page(s) : p. 25-29 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Adhésifs -- Appareils et matériel Adhésifs -- Séchage sous rayonnement ultraviolet Lampes Rayonnement ultraviolet Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Inexpensive and consistent curing of adhesive and coatings is still a ways off, manufacturers are making significant improvements in lamps (bulbs), light guides, filters and heat management technology, as well as in design and construction of their units to meet market demands. The ESAM 200 watt lamp used exclusively in the BlueWave platform has demonstrated several unique advantages for applications where high intensity cures that remain above 10 watts cm² for 2,000 hours and more. Considerable savings may be realized when one BlueWave lamp with multiple wands replaces two, three or even four 100 watt spot curing systems. Note de contenu : - Successful curing process - Intensity, lamp life & effective costs - Splitting light - Diminishing intensity - Maintaining intensity trough the light guide - Consistent curing intensity - Adhesive curing results En ligne : https://drive.google.com/file/d/14BWm2AsBmRPt4E4C3ETEV6ZMWw8WJY5p/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19996 [article]

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Understanding adhesive joints' behavior / Possart Wulff in ADHESIVES AGE, Vol. 45, N° 3 (03/2002)  

[article]  inADHESIVES AGE > Vol. 45, N° 3 (03/2002) . - p. 30-31 Titre : Understanding adhesive joints' behavior : Thermodynamic data of adhesion phenomena calculated with molecular modeling methods Type de document : texte imprimé Auteurs : Possart Wulff, Auteur ; Bernhard Schneider, Auteur Année de publication : 2002 Article en page(s) : p. 30-31 Langues : Américain (ame) Catégories : Acides et bases, Théories des Adhésion Alumine Anhydride maléique Assemblages collés Colles:Adhésifs Maléique, Acide Molécules -- Modèles Thermodynamique Index. décimale : 668.3 Adhésifs et produits semblables Résumé : The commonly used HSAB principle is often not enough to explain experimental observations. The calculation of thermodynamic data with DFT methods helps explain experimental observations made for the adhesion of maleic anhydride on natively oxidized aluminum. Note de contenu : - Model calculations - Theory and program - HSAB principle and local structure - HSAB principle & adhering molecule - Thermodynamic data En ligne : https://drive.google.com/file/d/1_m1e9r1M-mzuBYhPsZaHpFgIIo6gYjoL/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19997 [article]

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Film critic / R. K. Giunta in ADHESIVES AGE, Vol. 45, N° 3 (03/2002)  

[article]  inADHESIVES AGE > Vol. 45, N° 3 (03/2002) . - p. 32-33 et p. 37 Titre : Film critic : Analyzing the dewetting dynamics of thin epoxy films Type de document : texte imprimé Auteurs : R. K. Giunta, Auteur ; M. S. Kent, Auteur ; J. S. Hall, Auteur ; S. T. Hammerand, Auteur ; D. R. Tallant, Auteur ; M. J. Garcia, Auteur Année de publication : 2002 Article en page(s) : p. 32-33 et p. 37 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Colles:Adhésifs Couches minces Démouillage (chimie des surfaces) Epoxydes Mouillage (chimie des surfaces) Silicium Index. décimale : 668.3 Adhésifs et produits semblables Résumé : The equilibrium stability of thin adhesive films is of critical importance as adhesive bondlines approach micron-thicknesses. The dewetting behavior of an epoxy resin/crosslinker mixture on silicon was found to be related to the formation of a monomolecular absorbed film on the substrate surface. ATR-IR spectra of thin films of the epoxy mixture and its components are giving insight into the fundamental cause of the dewetting behavior of the epoxy. The data suggests molecular architecture of symmetry plays an important role. A complete understanding of the wetting and dewetting behavior of thin adhesive films is integral in ensuring strong, void-free, micron-thick bondlines. Note de contenu : - Experimental - Materials - Procedures - Results - Wetting/dewetting behavior - ToF-SIMS - ATR-IR spectroscopy En ligne : https://drive.google.com/file/d/1no1ammt5T64_myaVDwloD-M7hjx0Ef1-/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19998 [article]

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