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Adhesion measurement of thin films, thick films, and bulk coatings / Kashmiri Lal Mittal / Philadelphie [United States] : American Society for Testing and Materials (ASTM) (1978)
Titre : Adhesion measurement of thin films, thick films, and bulk coatings Type de document : texte imprimé Auteurs : Kashmiri Lal Mittal (1945-....), Editeur scientifique Editeur : Philadelphie [United States] : American Society for Testing and Materials (ASTM) Année de publication : 1978 Importance : 402 p. Présentation : ill. Format : 24 cm Note générale : Index Langues : Américain (ame) Langues originales : Américain (ame) Catégories : Adhésion
Couches épaisses
Couches minces
Revêtements:PeintureIndex. décimale : 541.34 Solutions Résumé : Adhesion measurement : Recent progress, unsolved problems, and prospects / Locus of failure and its implications for adhesion measurements / Problems in adhesion measurement / Experimental methods to determine locus of failure and bond. Failure mechanism in adhesive joints and coatings-substrate combinations / Thin-fil adhesion and adhesive failure. A perspective / Use of fracture mechanics concepts in testing of film adhesion / Techniques for measuring adhesive energies in metal/ceramic systems / Adhesion of thin plasma polymer films to plastics / Electromagnetic tensile adhesion test method / Measurements of ilm-substrate bond strength by laser spallation / Hardness and adhesion of filmed structures as determined by the scratch technique / Threshold adhesion failure : an approach to thin-tilm adhesion measurement using the stylus method / Adhesion of granular thin films / Adhesion measurement on thin evaporated films / Adhesion measurements on thick-film conductors / Adhesion of thick films to ceramic and its measurement by both destructive and nondestructive means /Evaluation of methods for performing adhesion measurements of thick-film terminations on chip components / Adhesion measurement technique for soldered thick-film conductors / Adhesion of flame-sprayed coatings /Adherence measurements and evaluation of thick-film platinum-gold / Adhesion testing of deposit-substrate combinations / Methods for evaluating adhesion of photoresist materials to semiconductor devices / Effect of aspect ration on tensile bond strength for butt joint of internal fracture. Theoretical and experimental analysis / Measuring the temperature dependence of the strength of metal-polymer joints / Peel test for determining the adhesion of electrodeposits on metallic substrates. Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=934 Réservation
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Code-barres Cote Support Localisation Section Disponibilité 0971 541.34 MIT Monographie Bibliothèque principale Documentaires Disponible A flexible solution to solderless surface mount / E. Ralph Egloff in ADHESIVES AGE, Vol. 38, N° 13 (12/1995)
[article]
Titre : A flexible solution to solderless surface mount Type de document : texte imprimé Auteurs : E. Ralph Egloff, Auteur Année de publication : 1995 Article en page(s) : p. 18-20 Langues : Américain (ame) Catégories : Adhésifs conducteurs
Conducteurs organiques
Couches épaisses
Electronique -- Matériaux
Electronique imprimée
Encapsulation
Encre électronique
PhotopolymèresIndex. décimale : 668.3 Adhésifs et produits semblables Résumé : Polymer thick film (PTF) technology for printed circuits has been used for a long time. Soldering onto the PTF has always been a problem and a multitude of ways have been devised to get around it. A flexible solution to solderless surface mount is a fully additive, fully compatible package of polymer thick film inks designed to enhance printed circuit technology. The package includes silver ink, dielectric ink, carbon ink, silver adhesive paste, and encapsulating photopolymer. These are used to attach surface mount devices (SMD) onto flexible polyester film when applied by screen print, stencil, and dot dispense methods. Early applications started with chip mount resistors, LEDs, or diodes. Improvements in technology have led to robust production with surface mounted active components.
Why should we use surface mount technology for flexible printed circuits? Everyone is trying to conform as quickly as possible to the Green revolution. Surface mount technology (SMT) for flexible printed circuitry (FPC) provides a clear means to lower costs and comply with environmental pressures while enhancing printed circuit functionality.
Performance is equal to copper etched circuits at speeds of up to 20 MHz at substantially lower costs, lighter weights and with the ability to be packaged into three dimensional cavities. Circuits for full travel keyboards, membrane switches, games, medical applications, sensors, displays and digitizers have used additive SMT worldwide for more than 10 years.Note de contenu : - Full additive and compatible
- Application
- Circuit design
- Choice of printer or prototype
- Environmental testingEn ligne : https://drive.google.com/file/d/1ugGH7Vj8To2TVCfHbm-USINaxZuFm-4O/view?usp=drive [...] Format de la ressource électronique : Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=20797
in ADHESIVES AGE > Vol. 38, N° 13 (12/1995) . - p. 18-20[article]Réservation
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Code-barres Cote Support Localisation Section Disponibilité 001058 - Périodique Bibliothèque principale Documentaires Disponible De-inking of thick film UV-cured coatings using high intensity ultrasound / A. N. Manning in SURFACE COATINGS INTERNATIONAL. PART B : COATINGS TRANSACTIONS, Vol. 87, B1 (02/2004)
[article]
Titre : De-inking of thick film UV-cured coatings using high intensity ultrasound Type de document : texte imprimé Auteurs : A. N. Manning, Auteur ; R. C. Thompson, Auteur Année de publication : 2004 Article en page(s) : p. 21-26 Note générale : Bibliogr. Langues : Anglais (eng) Catégories : Cavitation
Couches épaisses
Désencrage
Papier -- Revêtements
Sérigraphie
UltrasonsIndex. décimale : 667.9 Revêtements et enduits Résumé : The aim of this work was to investigate the use of high intensity ultrasound in the de-inking of papers printed with UV-cured inks. Thick ink films printed by screen process printing were subjected to 20kHz ultrasound. The effects of different exposure times were studied under conditions of neutral pH.
The treatment resulted in the controlled breakdown and detachment of solid and halftone printings into particle sizes that could be removed by commercial flotation and washing methods.Note de contenu : - Solid printings
- Halftone printingDOI : 10.1007/BF02699560 En ligne : https://link.springer.com/content/pdf/10.1007/BF02699560.pdf Format de la ressource électronique : Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=5478
in SURFACE COATINGS INTERNATIONAL. PART B : COATINGS TRANSACTIONS > Vol. 87, B1 (02/2004) . - p. 21-26[article]Réservation
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Code-barres Cote Support Localisation Section Disponibilité 000392 - Périodique Bibliothèque principale Documentaires Disponible Plastic optics in multiple layers / Christian Hopmann in KUNSTSTOFFE INTERNATIONAL, Vol. 104, N° 6 (06/2014)
[article]
Titre : Plastic optics in multiple layers : The Institute of Plastics Processing (IKV) researched the economic multilayer injection molding of thick-walled optical components Type de document : texte imprimé Auteurs : Christian Hopmann, Auteur ; Malte Röbig, Auteur ; Paul Walach, Auteur Année de publication : 2014 Article en page(s) : p. 40-43 Langues : Anglais (eng) Catégories : Couches épaisses
Matériel optique
Matières plastiques -- Moulage par injection
Structures multicouchesIndex. décimale : 668.4 Plastiques, vinyles Résumé : The molding of thick-walled optical components made of plastics is not only a technical challenge. Until now, there is no economic production method for these precision components. A new option is the approach to produce thick-walled lenses in a multilayered structure. As a result the cycle time can be shortened significantly and production processes become more economical. Note de contenu : - Fundamentals of multilayer injection molding
- Mold technology for the multilayer principle
- Bond strength and optical quality of the multilayer injection moldingEn ligne : https://drive.google.com/file/d/1Xbzd4lbC9UFjKaildg9N-I0vHHHCY4jQ/view?usp=drive [...] Format de la ressource électronique : Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=21626
in KUNSTSTOFFE INTERNATIONAL > Vol. 104, N° 6 (06/2014) . - p. 40-43[article]Réservation
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Code-barres Cote Support Localisation Section Disponibilité 16367 - Périodique Bibliothèque principale Documentaires Disponible Preparation and rheological behavior of lead-free graphite conducting paste / Luo Shiyong in JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH, Vol. 10, N° 6 (11/2013)
[article]
Titre : Preparation and rheological behavior of lead-free graphite conducting paste Type de document : texte imprimé Auteurs : Luo Shiyong, Auteur ; Xu Wencai, Auteur ; Wang Ning, Auteur ; Chen Meng, Auteur ; Lv Yong, Auteur Année de publication : 2013 Article en page(s) : p. 769-774 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Adhésion
Couches épaisses
Dureté VickersLa mesure de dureté Vickers se fait avec une pointe pyramidale normalisée en diamant de base carrée et d'angle au sommet entre faces égal à 136°. L'empreinte a donc la forme d'un carré ; on mesure les deux diagonales d1 et d2 de ce carré à l'aide d'un appareil optique. On obtient la valeur d en effectuant la moyenne de d1 et d2. C'est d qui sera utilisé pour le calcul de la dureté. La force et la durée de l'appui sont également normalisées.
Essai de dureté
Graphite
Rhéologie
Thermocinétique
Thixotropie
Verre
ViscoélasticitéIndex. décimale : 667.9 Revêtements et enduits Résumé : A lead-free graphite conducting paste was prepared by using graphite powder, lead-free barium boron low-melting glass and ethyl cellulose solution. By analyzing the sheet resistance, Vickers hardness as well as the adhesion strength of the fired film prepared by the pastes formulated with different composition, the composition of the paste with preferable properties was evaluated in weight percent: organic vehicle 60, graphite powder 15–20, and low-melting glass 20–25. The films, prepared by the pastes using the lead-free glass with a glass transition temperature of 476°C, were perfectly flat and compact after fired at a peak temperature within the range of 540 to 590°C. The sheet resistance of the fired film with glass content of 25 wt% was 135 ?/mm2 at the film thickness of 25 ± 3 ?m, while the Vickers hardness was 12.3 N/mm2 and the adhesion strength to soda lime silicate glass substrate was 45.6 N/mm2. In addition, the rheological, thixotropic, and viscoelasticity behaviors of the typical paste were characterized and the effects on the screen-printing ability were analyzed in detail. It is found that a slight flocculated network structure is formed in the paste at rest, but the flocculated structure is very slight due to the steric effect of the ethyl cellulose macromolecules and good dispersing. The rheological, thixotropic, and viscoelasticity behaviors of the typical paste were similar to those of the screen-printing pastes with a high solid content of filler. Note de contenu : - Glass content in the graphite conducting paste
- Rheological behavior
- Thixotropic behavior
- Viscoelastic behaviorDOI : 10.1007/s11998-008-9120-x En ligne : https://link.springer.com/content/pdf/10.1007%2Fs11998-008-9120-x.pdf Format de la ressource électronique : Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19816
in JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH > Vol. 10, N° 6 (11/2013) . - p. 769-774[article]Réservation
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Code-barres Cote Support Localisation Section Disponibilité 15744 - Périodique Bibliothèque principale Documentaires Disponible The changing face of intumescent coatings / Andrew Taylor in POLYMERS PAINT COLOUR JOURNAL - PPCJ, Vol. 204, N° 4596 (05/2014)
PermalinkThe dependence of pendulum hardness on the thickness of acrylic coating / Xiaoyang Ma in JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH, Vol. 10, N° 3 (05/2013)
PermalinkUV drying : The first industrial one step process / Jean-Pierre Fouassier in EUROPEAN COATINGS JOURNAL (ECJ), N° 4/95 (04/1995)
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