Accueil
ADHESIVES & SEALANTS INDUSTRY (ASI) . Vol. 16, N° 6Dispensing and curing equipment directoryMention de date : 06/2009 Paru le : 08/06/2009 |
Dépouillements
Ajouter le résultat dans votre panierThe search for improved alternatives in epoxy toughening / William Starner in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 16, N° 6 (06/2009)
[article]
Titre : The search for improved alternatives in epoxy toughening : New research shows the performance benefits of glycidyl esters Type de document : texte imprimé Auteurs : William Starner, Auteur Année de publication : 2009 Article en page(s) : p. 19-23 Langues : Américain (ame) Catégories : Adhésifs -- Additifs
Adhésion
Bisphénol A
Epoxydes
Esters de glycidyle
Formulation (Génie chimique)
Plastifiants
Transition vitreuse
ViscositéIndex. décimale : 668.3 Adhésifs et produits semblables Résumé : The test results demonstrate that the modifiers examined in this study, whether adducted or glycidated, provide significant advantages in performance properties compared to the unmodified control formulation. Results also showed that glycidyl ester modifiers provide significant advantages over the bisphenol A epoxy adducts in their ability to reduce processing viscosity without sacrificing adhesive or toughener performance.
Other conclusions of the study include the following : The glycidyl ester modifiers are lower in viscosity and yield lower formulation mix viscosities than the industry benchmark.
Selection of the proper glycidyl ester will allow for higher Tg and desired adhesive and toughener performance.
The end group functionality appears to affect compatibility in the cured epoxy matrix, which in turn affects Tg. Glycidyl esters exhibit less compatibility than epoxy adducts and thus give higher Tg.
The study shows that adhesive properties are affected by the polymer backbone. Both polyester backbones and butadiene/acrylonitrile copolymer backbones provide good adhesion.
The best adhesion performance was achieved with glycidyl ester modifiers prepared using a CTBN.
No individual modifier will yield optimal results in all applications. The results of this study, however, demonstrate that there are newer alternatives with the potential to deliver better performance results in applications in which a low-viscosity modifier is needed. Glycidyl esters offer a number of advantages over the industry benchmark and, therefore, should be considered as the market continues to move toward products that are both energy- and cost-efficient.Note de contenu : - STUDY DESCRIPTION
- MODEL FORMULA AND TEST PROTOCOL
- RESULTS AND DISCUSSION : Bisphenol A epoxy adducted modifiers - Glycidyl ester modifiers
- FIGURES : 1. SEM micrographs of unmodified vs. modified cured epoxy formulations - 2. Backbone and end group structures
- TABLES : 1. Epoxy formulations using bisphenol A epoxy adducted esters as modifiers - 2. Epoxy formulations using glycidyl esters as modifiersEn ligne : http://www.adhesivesmag.com/articles/88175-the-search-for-improved-alternatives- [...] Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=25906
in ADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 16, N° 6 (06/2009) . - p. 19-23[article]Réservation
Réserver ce document
Exemplaires (1)
Code-barres Cote Support Localisation Section Disponibilité 011389 - Périodique Bibliothèque principale Documentaires Disponible Energizing product designs with electrically conductive adhesives / Deepak Hariharan in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 16, N° 6 (06/2009)
[article]
Titre : Energizing product designs with electrically conductive adhesives Type de document : texte imprimé Auteurs : Deepak Hariharan, Auteur Année de publication : 2009 Article en page(s) : p. 26-27 Langues : Américain (ame) Catégories : Adhésifs -- Applications industrielles
Adhésifs conducteurs
Adhésifs sensibles à la pression
Conducteurs organiquesIndex. décimale : 668.3 Adhésifs et produits semblables Résumé : As electronic devices become increasingly smaller and more complex, reducing the size of component space becomes more important. Electrically conductive pressure-sensitive adhesives (PSAs) enable smaller electronic designs through thin, effective bonds because they not only bond components together, but also provide the added functionality of providing pathways for electrical currents. By eliminating the need for other conductive elements, electrically conductive PSAs present options for simplifying electronic device design and manufacture. Electrically conductive PSAs are suited for applications such as electrical interconnections for low-current circuits; splicing conductive materials; bonding electromagnetic interference gaskets; ground plane assembly ; and static control for printed circuit boards and assembly.
The days of "glue" simply bonding electrical components have passed. Today’s adhesive systems have evolved into sophisticated polymer formulations capable of delivering reliable bonds with added functionality. For example, electrically conductive PSAs are highly tailored polymer formulations loaded with materials to create conductive properties in the adhesive. The adhesive is then coated onto a carrier/substrate that may also contribute to the tape’s conductive properties in single- or double-faced constructions. PSAs may also take the form of a self-wound transfer adhesive.Note de contenu : - Performance is key
- Applying the technology
- Electrically conductive bus bars for photovoltaic modulesEn ligne : http://www.adhesivesmag.com/articles/88173-energizing-product-designs-with-elect [...] Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=25907
in ADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 16, N° 6 (06/2009) . - p. 26-27[article]Réservation
Réserver ce document
Exemplaires (1)
Code-barres Cote Support Localisation Section Disponibilité 011389 - Périodique Bibliothèque principale Documentaires Disponible