| Titre : |
Adhesion measurement of thin films, thick films, and bulk coatings |
| Type de document : |
texte imprimé |
| Auteurs : |
Kashmiri Lal Mittal (1945-....), Editeur scientifique |
| Editeur : |
Philadelphie [United States] : American Society for Testing and Materials (ASTM) |
| Année de publication : |
1978 |
| Importance : |
402 p. |
| Présentation : |
ill. |
| Format : |
24 cm |
| Note générale : |
Index |
| Langues : |
Américain (ame) Langues originales : Américain (ame) |
| Catégories : |
Adhésion
Couches épaisses
Couches minces
Revêtements:Peinture
|
| Index. décimale : |
541.34 Solutions |
| Résumé : |
Adhesion measurement : Recent progress, unsolved problems, and prospects / Locus of failure and its implications for adhesion measurements / Problems in adhesion measurement / Experimental methods to determine locus of failure and bond. Failure mechanism in adhesive joints and coatings-substrate combinations / Thin-fil adhesion and adhesive failure. A perspective / Use of fracture mechanics concepts in testing of film adhesion / Techniques for measuring adhesive energies in metal/ceramic systems / Adhesion of thin plasma polymer films to plastics / Electromagnetic tensile adhesion test method / Measurements of ilm-substrate bond strength by laser spallation / Hardness and adhesion of filmed structures as determined by the scratch technique / Threshold adhesion failure : an approach to thin-tilm adhesion measurement using the stylus method / Adhesion of granular thin films / Adhesion measurement on thin evaporated films / Adhesion measurements on thick-film conductors / Adhesion of thick films to ceramic and its measurement by both destructive and nondestructive means /Evaluation of methods for performing adhesion measurements of thick-film terminations on chip components / Adhesion measurement technique for soldered thick-film conductors / Adhesion of flame-sprayed coatings /Adherence measurements and evaluation of thick-film platinum-gold / Adhesion testing of deposit-substrate combinations / Methods for evaluating adhesion of photoresist materials to semiconductor devices / Effect of aspect ration on tensile bond strength for butt joint of internal fracture. Theoretical and experimental analysis / Measuring the temperature dependence of the strength of metal-polymer joints / Peel test for determining the adhesion of electrodeposits on metallic substrates. |
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Adhesion measurement of thin films, thick films, and bulk coatings / Philadelphie [United States] : American Society for Testing and Materials (ASTM) (1978)
