Titre : |
Packaging Productivity : Measuring non-pressure-sensitive adhesives’ hot tack to improve productivity in packaging processes |
Type de document : |
texte imprimé |
Auteurs : |
Martha Belem Mendieta, Auteur ; Alejandro C. Esquivel de la Garza, Auteur |
Année de publication : |
2010 |
Article en page(s) : |
p. 18-20 |
Langues : |
Américain (ame) |
Catégories : |
Adhésifs sensibles à la pression Adhésifs thermofusibles Copolymère styrène butadiène styrène Emballages Rhéologie
|
Index. décimale : |
668.3 Adhésifs et produits semblables |
Résumé : |
Many characterization techniques are used to measure the bond strength of hot-melt pressure-sensitive adhesives (HMPSAs). These calculations are usually performed by measuring the force required to debond the adhesive holding two substrates together. Measurement procedures vary by substrate, contact time, area and force used to make the bond ; debonding procedure variables include speed and the debonding angle.
PSAs are typically soft and tacky at temperatures higher than their glass-transition temperature (Tg) ; conversely, they are firmer at lower-than-ambient temperatures. This allows tack to be measured at standard evaluation conditions (23°C and 50 % relative humidity).
Unlike HMPSAs, hot-melt non-pressure-sensitive-adhesives (HMNPSAs) do not develop tack at room temperature. Instead, they become tacky when they are applied at high temperatures; after cooling to room temperature, tack is lost. Therefore, procedures commonly used to measure tack cannot be used to evaluate these materials.
In some packaging processes, such as carton box forming and closure using HMAs, optimal process productivity depends on the right application temperature for optimal cohesion. Long and costly trial-and-error tests are usually used to find optimal application temperature for NPSAs for those applications.
This article discusses probe-tack measurements and rheological results at high temperatures for HMNPSAs formulated with Dynasol styrene-butadiene-styrene (SBS) copolymers. |
En ligne : |
http://www.adhesivesmag.com/Articles/Feature_Article/BNP_GUID_9-5-2006_A_1000000 [...] |
Format de la ressource électronique : |
Web |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=8818 |
in ADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 17, N° 3 (03/2010) . - p. 18-20