| Titre : |
Numerical simulation of a thermoviscoelastic frictional problem with application to the hot-embossing process for manufacturing of microcomponents |
| Type de document : |
texte imprimé |
| Auteurs : |
K. K. Kabanemi, Auteur ; J. P. Marcotte, Auteur ; J.-F. Hétu, Auteur ; M. Worgull, Auteur ; M. Heckele, Auteur |
| Année de publication : |
2009 |
| Article en page(s) : |
p. 174-184 |
| Note générale : |
Bibliogr. |
| Langues : |
Anglais (eng) |
| Index. décimale : |
668.9 Polymères |
| Résumé : |
Hot embossing is a compression molding technique used for high replication accuracy of small features. One of the most sensitive phases of the process is the de-embossing stage during which the patterned part has to be demolded. In this paper, the demolding stage is considered as a frictional contact problem between a rigid mold insert and a viscoelastic polymer sheet as it deforms and cools inside a mold under an applied force. The contact is modeled with a modified Coulomb's law of dry friction while a generalized Maxwell model is used to describe the polymer behavior during embossing, cooling and de-embossing stages. The heat transfer between the mold insert and the patterned polymer sheet is solved through a domain decomposition method. A finite element approximation based on a penalized technique is proposed and analyzed. The purpose of this modeling approach is to predict dimensional stability and residual shape of microcomponents in the hot embossing process. Such a prediction will allow one to assign appropriate processing conditions that minimize geometrical imperfections and increase replication accuracy. |
| DOI : |
10.3139/217.2227 |
| En ligne : |
https://drive.google.com/file/d/1bzr4tIXABbqlRP-0xBGfT1uLTTyQNQ9X/view?usp=drive [...] |
| Format de la ressource électronique : |
Pdf |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=5249 |
in INTERNATIONAL POLYMER PROCESSING > Vol. XXIV, N° 2 (05/2009) . - p. 174-184
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