[article]
Titre : |
Solvent-free urethane-acrylic hybrid polymers for coatings |
Type de document : |
texte imprimé |
Auteurs : |
Ernie C. Galgoci, Auteur ; Charles R. Hegedus, Auteur ; Frederick H. Walker, Auteur ; Daniel J. Tempel, Auteur ; Frank R. Pepe, Auteur ; Kenneth A. Yoxheimer, Auteur ; Alan S. Boyce, Auteur |
Année de publication : |
2005 |
Article en page(s) : |
p. 28-36 |
Note générale : |
Bibliogr. |
Langues : |
Américain (ame) |
Index. décimale : |
667.9 Revêtements et enduits |
Résumé : |
Urethane-acrylic hybrid polymer dispersions (HPDs) can offer cost/performance advantages over common 1K coating materials such as polyurethane dispersions (PUDs), acrylic emulsions, and blends thereof. One disadvantage of both PUDs and HPDs is the inclusion of N-methylpyrrolidone (NMP) solvent, which is commonly a necessary processing solvent included at levels ranging from about 3 to 15%. Since NMP has recently been added to California’s Proposition 65 list and has generally become objectionable for use in Europe, it has become desirable to eliminate NMP from these products. Consequently, solvent-free versions of HPDs have been developed that, despite the lack of NMP used in their preparation, have been found to perform favorably compared to analogous solvent-containing polymers (both hybrid and PUD). Like their solvent-containing counterparts, the outstanding properties of the new solvent-free versions are apparently due to their true hybrid nature, which is analogous to an interpenetrating network (IPN) as indicated by a broad glass transition temperature range. Although the NMP-free versions still require coalescing solvents for adequate film formation, they offer greater flexibility in choosing alternate solvents when formulating high performance coatings. |
En ligne : |
https://drive.google.com/file/d/1C-UhcnfFGnnQwkl3TULi-qq4yvotVDtZ/view?usp=drive [...] |
Format de la ressource électronique : |
Pdf |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=5528 |
in COATINGS TECH > Vol. 2, N° 13 (02/2005) . - p. 28-36
[article]
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