Al2o3 films with Ni-based buffer layer prepared by plasma-ion assisted deposition on Cu substrate / Lixin Song in JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH, Vol. 3, N° 3 (07/2006)  

[article]  inJOURNAL OF COATINGS TECHNOLOGY AND RESEARCH > Vol. 3, N° 3 (07/2006) . - P. 237-240 Titre : Al2o3 films with Ni-based buffer layer prepared by plasma-ion assisted deposition on Cu substrate Type de document : texte imprimé Auteurs : Lixin Song, Auteur ; Lili Zhao, Auteur ; J. Wu, Auteur ; L. Wu, Auteur Année de publication : 2006 Article en page(s) : P. 237-240 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Alumine Analyse spectrale Cristallographie Cuivre Diffusion -- Physique nucléaire Isolation électrique Microscopie à force atomique Nickel Le nickel est un élément chimique, de symbole Ni et de numéro atomique 28. Le nickel est un métal blanc argenté qui possède un éclat poli. Il fait partie du groupe du fer. C'est un métal ductile (malléable). On le trouve sous forme combinée au soufre dans la millérite, à l'arsenic dans la nickéline. Grâce à sa résistance à l'oxydation et à la corrosion, il est utilisé dans les pièces de monnaie, pour le plaquage du fer, du cuivre, du laiton, dans certaines combinaisons chimiques et dans certains alliages. Il est ferromagnétique, et est fréquemment accompagné de cobalt. Il est particulièrement apprécié pour les alliages qu'il forme. Projection au plasma Index. décimale : 667.9 Revêtements et enduits Résumé : In this study, Al2O3 films with an Ni-based buffer layer were prepared on a Cu substrate by plasma-ion assisted deposition (PIAD). The main purpose of this study is to develop a novel electrical insulating film to be used at high temperature. X-ray diffraction (XRD) spectra show the Al2O3 films prepared by this method are amorphous. The results of atomic force microscopy (AFM), scanning electron microscopy (SEM), and auger electron spectroscopy (AES) analyses reveal that the Al2O3 films perfectly adhere to the substrate through the buffer layer, no visible defects were observed, and no impurity from Ni or Cu was detected. The diffusion of Cu into the Al2O3 film at high temperature is suppressed. Al2O3 films with an Ni-based buffer layer exhibit excellent resistivity (>1010Ω·cm) even after experiencing a high temperature environment as high as 600°C 10 times. DOI : 10.1007/BF02774513 En ligne : https://link.springer.com/content/pdf/10.1007%2FBF02774513.pdf Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=3697 [article]

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Effects of colloidal silica on the properties of POSS-containing fluorinated poly(styrene–acrylate)/SiO2 composite materials / Wenbo Liao in JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH, Vol. 18, N° 1 (01/2021)  

[article]  inJOURNAL OF COATINGS TECHNOLOGY AND RESEARCH > Vol. 18, N° 1 (01/2021) . - p. 107-116 Titre : Effects of colloidal silica on the properties of POSS-containing fluorinated poly(styrene–acrylate)/SiO2 composite materials Type de document : texte imprimé Auteurs : Wenbo Liao, Auteur ; Liuyong Zou, Auteur ; Shaona Zheng, Auteur ; Lili Zhao, Auteur ; Xiangxuan Huang, Auteur ; Lingyun Ye, Auteur ; Guoyu Zhong, Auteur Année de publication : 2021 Article en page(s) : p. 107-116 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Caractérisation Colloides Copolymère styrène acrylate Copolymères greffés Dioxyde de silicium Hydrophobie Revêtements organiques Rugosité Silsesquioxanes oligomères polyhèdres Sol-gel, Procédé Stabilité thermique Index. décimale : 667.9 Revêtements et enduits Résumé : Polyhedral oligomeric silsesquioxane (POSS)-containing fluorinated poly(styrene–acrylate)/SiO2 (POSS-FPSA/SiO2) composite materials were prepared by preemulsification and direct blending method. The SiO2 particles were induced aggregated onto the surface of POSS, and sol–gel processes were simultaneously carried out with addition of co-solvent to form raspberry-like structure. 29Si NMR and XRD results confirmed that POSS were successfully grafted to polymer and were evenly dispersed uniformly in polymer matrix. The average diameter of composite latexes increased from 63 to 81 nm with increasing addition of SiO2 content. AFM and WCA images confirmed that sol–gel processes were promoted by increasing addition of SiO2 content, which improved the roughness and hydrophobicity of composite films. XPS spectra displayed that two kinds of Si–O bonds existed on the surface of composite films. One was related to the Si–O groups of SiO2, and the other was attributed to the Si–O–Si groups obtained from the sol–gel processes. The peak area of the former decreased from 56.86% to 38.78%, while the latter increased from 43.14% to 62.22%. TGA curves demonstrated that the composite film exhibited better thermal stability when the SiO2 content was 10.0%. In addition, serious phase separation would decrease the thermal stability of composite films. Note de contenu : - EXPERIMENTAL : Materials - Preparation of POSS-FPSA/SiO2 composite materials - Characterization - RESULTS AND DISCUSSION : The preparation and structure of POSS-FPSA SiO2 composite materials - Effects SiO2 content on the properties of POSS-FPSA/SiO2 composite materials - Scheme : The synthetic route of PSA, POSS-FPSA, and POSS-FPSA/SiO2 DOI : https://doi.org/10.1007/s11998-020-00384-7 En ligne : https://link.springer.com/content/pdf/10.1007/s11998-020-00384-7.pdf Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=35355 [article]

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Facile fabrication of fluorine–silicon-containing poly (styrene–acrylate)/SiO2 hydrophobic composites by combining physically mixing and sol–gel process / Lingyun Ye in JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH, Vol. 16, N° 5 (09/2019)  

[article]  inJOURNAL OF COATINGS TECHNOLOGY AND RESEARCH > Vol. 16, N° 5 (09/2019) . - p. 1243-1252 Titre : Facile fabrication of fluorine–silicon-containing poly (styrene–acrylate)/SiO2 hydrophobic composites by combining physically mixing and sol–gel process Type de document : texte imprimé Auteurs : Lingyun Ye, Auteur ; Guanhao Ma, Auteur ; Shaona Zheng, Auteur ; Xiangxuan Huang, Auteur ; Lili Zhao, Auteur ; Hongbin Luo, Auteur ; Wenbo Liao, Auteur Année de publication : 2019 Article en page(s) : p. 1243-1252 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Composites Copolymère styrène acrylate Dioxyde de silicium Fluor Gel de silice Hydrophobie Sol-gel, Procédé Stabilité thermique Index. décimale : 667.9 Revêtements et enduits Résumé : Novel hydrophobic composites (FS-PSA/SiO2) were prepared by directly physically mixing fluorine–silicon-containing poly (styrene–acrylate) latexes (FS-PSA) with colloidal silica. Sol–gel processes were carried out between silica particles and silanol groups on the surface of poly (styrene–acrylate) latexes to enhance the roughness and hydrophobicity of composite films. TEM photos revealed that FS-PSA latexes exhibited a clear core–shell structure, and the intermolecular hydrogen bonding guaranteed the uniform dispersion of silica particles. The average diameter data indicated that the copolymerization and sol–gel process had all increased the average diameter of the composite latexes. FTIR and XPS spectra confirmed that two kinds of Si–O bonds existed in the composite films, of which one was related to the Si–O groups of colloidal silica while the other was related to the Si–O–Si groups obtained from the sol–gel processes. SEM and AFM images revealed that the sol–gel processes had increased the roughness of the composite films. The water contact angle (WCA) of the composite films were found to increase with the copolymerization and sol–gel processes. Thermogravimetric analysis (TGA) curves demonstrated that the FS-PSA/SiO2 composite films exhibited much better thermal stability than the PSA and FS-PSA films. Note de contenu : - EXPERIMENTAL : Materials - Preparation of poly(styrene-acrylate) (PSA) and fluorine-silicone-containing poly(styrene-acrylate) materials (FS-PSA) - Preparation of FS-PSA/SiO2 composites - RESULTS AND DISCUSSION : The preparation of the FS-PAS and FS-PAS/SiO2 composites - The chemical structure - The surface wetting property and surface morphology - Formation mechanism of composite films - The thermal stability DOI : 10.1007/s11998-019-00198-2 En ligne : https://link.springer.com/content/pdf/10.1007%2Fs11998-019-00198-2.pdf Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=33008 [article]

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