Titre : |
Robust superhydrophilic antifogging coatings by a facile sol-gel method |
Type de document : |
texte imprimé |
Auteurs : |
Chong Ke, Auteur ; Chenhua Zhang, Auteur ; Zhang Huijun, Auteur ; Yongdong Jiang, Auteur |
Année de publication : |
2023 |
Article en page(s) : |
p. 1343-1352 |
Note générale : |
Bibliogr. |
Langues : |
Américain (ame) |
Catégories : |
Caractérisation Dioxyde de silicium Hydrophilie Nanoparticules Revêtements anti-buée Sol-gel, Procédé Tétraéthoxysilane Transparence (optique)
|
Index. décimale : |
667.9 Revêtements et enduits |
Résumé : |
In this study, a simple one-step sol–gel process was applied to synthesize SiO2-based superhydrophilic antifogging coatings on glass substrates. In this process, Si(OH)4 sol was first prepared and then SiO2 nanoparticles were added to the sol to form coating solutions. The influence of both the Si(OH)4 sol and SiO2 nanoparticle contents on the coating properties was investigated. Their contents have significant effects on the coatings’ properties, including hydrophilicity and surface morphology. The water contact angle of the optimum coating is about 3.4°. Besides, as revealed by the steam test and freeze test, the optimum superhydrophilic coating demonstrates good antifogging properties and an adequate level of mechanical strength as well. Compared to other techniques used to fabricate antifogging coating on glass substrate, the sol–gel-based process developed in this study requires no expensive equipment, and the processing time is largely shortened. Thus, such technique has great potential applications in the field of coating industry. |
Note de contenu : |
- Materials
- Preparation of the superhydrophilic coatings
- Characterization |
DOI : |
https://doi.org/10.1007/s11998-022-00748-1 |
En ligne : |
https://link.springer.com/content/pdf/10.1007/s11998-022-00748-1.pdf?pdf=button% [...] |
Format de la ressource électronique : |
Pdf |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=39720 |
in JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH > Vol. 20, N° 4 (07/2023) . - p. 1343-1352