| Titre : |
Reliably reinforcing ball grid arrays while minimizing stress on solder joints |
| Type de document : |
texte imprimé |
| Auteurs : |
Markus Schindler, Auteur |
| Année de publication : |
2023 |
| Article en page(s) : |
p. 13-16 |
| Langues : |
Multilingue (mul) |
| Catégories : |
Adhésifs dans les équipements électriques/électroniques
Assemblages collés
Bordures
Circuits intégrés
|
| Index. décimale : |
668.3 Adhésifs et produits semblables |
| Résumé : |
No one likes stress. But stress is not just unpleasant for people ; it can also have negative effects on increasingly complex chip packages soldered onto circuit boards as integrated functinal units. Processes such as capillary underfill, corner fill, or edge bond are suitable for reinforcing these assemblies onto boards. Edge bond in particular is less likely to put stress on the component, extends the service life of the packages, and simplifies reworkability. |
| Note de contenu : |
- First "Moore's law", now "more than moore"
- Larger assemblies with increased functional density
- Capillary underfill for reinforcing BGAs
- Edge bond as a stress-free reinforcement
- Corner fill as another option for reinforcing complex packages
- Fig. 1 : Warpage of a package due to the difference in thermal length expansion of different materials
- Fig. 2 : UV-curing edge bond on a test component and micrograph : edge bond only wets the flank and does not run under the package. No solder joint is bonded, which significantly simplifies any rework
- Fig. 3 : Schematic of the test circuit where resistance is measured and the recorded measured resistance under stress (in this example, thermal shock) for several test setups
- Fig. 4 : In the case of heat curing, the stress-free state of the adhesive is at the curing temperature (e.g., 100 °C), which means stresses are formed at room temperature and UV curing defines the stress-free state at room temperature
- Fig. 5 : Edge bond, corner fill and capillary underfill. Three different reinforcement options for chip packages on boards. Areas where the adhesive is applied are marked in pink |
| En ligne : |
https://drive.google.com/file/d/1b_F5OtDGyryUj_16v51AuPg0NXYhvQ5_/view?usp=drive [...] |
| Format de la ressource électronique : |
Pdf |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=39389 |
in ADHESION - ADHESIVES + SEALANTS > Vol. 20, N° 2/2023 (2023) . - p. 13-16
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Reliably reinforcing ball grid arrays while minimizing stress on solder joints in ADHESION - ADHESIVES + SEALANTS, Vol. 20, N° 2/2023 (2023)
