| Titre : |
Resource efficiency in electronics manufacturing |
| Type de document : |
texte imprimé |
| Auteurs : |
Karin Steinmetzer, Auteur |
| Année de publication : |
2022 |
| Article en page(s) : |
p. 12-17 |
| Langues : |
Multilingue (mul) |
| Catégories : |
Adhésifs -- Application-dosage
Adhésifs dans les équipements électriques/électroniques
Batteries électriques
Coût -- Contrôle
Déchets -- Réduction
Enrobage (technologie)
|
| Index. décimale : |
668.3 Adhésifs et produits semblables |
| Résumé : |
Saving resources in electronics manufacturing is not an end in itself. It is closely linked with reducing costs and gaining a competitive advantage. However, innovative adhesion and potting technologies in combination with highly functional adhesives and potting media make a significant contribution to the ideal union between economic performance and a reduced ecological footprint. |
| Note de contenu : |
- Guiding principles
- Long-term protection of sensitive electronic components
- Component design as the starting point
- Right on the dot
- Quality control that saves space and material
- One step ahead
- High performance with multiple
- Economical material management
- Understanding and developing processes
- Application example : E-mobility
- Fig. 1 : Only electronic equipment that is well protected will be safe and durable
- Fig. 2 : The DosPL DPL2001 low-volume dispenser can position both small and large dots with high precision
- Fig. 3 : In addition to their main task of providing traceable documentation for quality levels, the vision systems prevent material waste
- Fig. 4 : The high-performance DosP DP2001 dispenser operates up to ten times faster than conventional systems
- Fig. 5 : Up to 90 % reduction in material waste each time a cartridge is changed thanks to the innovative docking sleeve
- Fig; 6 : Chemical and analytical expertise is required to ensure optimum material utilization
- Fig. 7 : Complex dispensing and potting applications for e-mobility battery production |
| En ligne : |
https://drive.google.com/file/d/1q-DnHYi3xEnFiIooCnkoqL0uY3g1EITe/view?usp=drive [...] |
| Format de la ressource électronique : |
Pdf |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=38006 |
in ADHESION - ADHESIVES + SEALANTS > Vol. 19, N° 3/2022 (2022) . - p. 12-17
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Resource efficiency in electronics manufacturing in ADHESION - ADHESIVES + SEALANTS, Vol. 19, N° 3/2022 (2022)
