Nondestructive inspection for heat sink efficiency / Tom Adams in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 24, N° 6 (06/2017)  

[article]  inADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 24, N° 6 (06/2017) . - p. 27-31 Titre : Nondestructive inspection for heat sink efficiency : Acoustic micro-imaging tools produce acoustic images of internal features, including gaps, in electronic components Type de document : texte imprimé Auteurs : Tom Adams, Auteur Année de publication : 2017 Article en page(s) : p. 27-31 Langues : Américain (ame) Catégories : Adhésifs dans les équipements électriques/électroniques Assemblages collés Contrôle non destructif Dissipation d'énergie Isolation thermique Température Thermocinétique Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Electronic components that contain a die require a path by which excess heat can be removed from the component package. In low-voltage plastic-encapsulated microcircuits, the heat may simply travel by conduction through the die attach and the die paddle for dissipation through the bottom of the package. In higher-voltage integrated circuit (IC) packages and in larger items such as insulated-gate bipolar transistor (IGBT) modules, a separate metal heat sink may be adhesively bonded to the package. The heat sink promotes conduction and prevents the temperature of the die from rising to a point where the circuitry on the die will fail. The bonding agent holding the heat sink in place may be solder, epoxy or another material. The heat sink is usually on the bottom of the component package, although some flip chips have a heat sink on the top side of the package. Note de contenu : - FIGURES : 1. Ultrasonic echoes from beneath this heat sink revealed numerous voids (white features) in the adhesive material - 2. Focused and gated on the die, ultrasound showed voids in the die attach in this IGBT module, as well as the acoustic shadows of numerous larger voids in the solder - 3. This image of a warped IGBT raft used ultrasound to report distance from the heat sink as color for the various regions of the heat sink and for the voids at various depths in the solder En ligne : http://www.adhesivesmag.com/articles/95524-nondestructive-inspection-for-heat-si [...] Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=28752 [article]

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