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Electrical conductive adhesives with nanotechnologies / Yi Li / New York [United States] : Springer (2010)
Titre : Electrical conductive adhesives with nanotechnologies Type de document : texte imprimé Auteurs : Yi Li, Auteur ; Daniel Lu, Auteur ; C. P. Wong, Auteur Editeur : New York [United States] : Springer Année de publication : 2010 Importance : VI-437 p. Présentation : ill. Format : 24 cm ISBN/ISSN/EAN : 978-0-387-88782-1 Prix : 128 E Note générale : Index - Bibliogr. Langues : Américain (ame) Catégories : Adhésifs conducteurs
Conduction électrique
NanotechnologieIndex. décimale : 668.3 Adhésifs et produits semblables Résumé : Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging, discussing the various electrical adhesive options currently available. The book focuses extensively on Electrically Conductive Adhesives (ECAs), as well as other adhesives such as lead-free soldering, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACFs) and Nonconductive Adhesives/Films (NCA/NCFs). The authors also present examples of how conductive adhesives can be applied to nano techniques, while making important mentions of recent research and development breakthroughs in the fields.
Drawing upon tireless research, years of theoretical development and practical experience, and utilizing numerous visual examples and illustrative applications, authors CP Wong, Yi Li and Daniel Lu cover electrically conductive adhesives in depth, while also describing :
The electrical properties, thermal performance, bonding pressure, assembly and reliability of numerous types of electrically conductive adhesives
The similarities and differences between lead-free soldering techniques and electrically conductive adhesives, while also discussing the advantages of ECAs.
Insights into the future of nano ECAs, as well as projections of future industry trends.
Electrical Conductive Adhesives with Nanotechnologies is a must-read for both researchers and active engineers in the electronic packaging field.Note de contenu : - Nanotechnology
- Characterizations of electrically conductive adhesives
- Isotropically conductive adhesive (ICAs)
- Anisotropically conductive adhesives/films (ACA/ACF)
- Non-conductive adhesives/films (NCA/NCF)
- Conductive nano-inks
- Intrinsically conducting polymers (ICPs)
- Future trend of conductive adhesive technologyPermalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=25204 Réservation
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Code-barres Cote Support Localisation Section Disponibilité 17736 668.3 LI Monographie Bibliothèque principale Documentaires Disponible Electrical conductive adhesives with nanotechnologies / Yi Li / New York [United States] : Springer (2010)
Titre : Electrical conductive adhesives with nanotechnologies Type de document : texte imprimé Auteurs : Yi Li, Auteur ; Daniel Lu, Auteur ; C. P. Wong, Auteur Editeur : New York [United States] : Springer Année de publication : 2010 Importance : XII-437 p. Présentation : ill. Format : 24 cm ISBN/ISSN/EAN : 978-1-4899-8307-7 Prix : 131 E Note générale : Index - Bibliogr. Langues : Anglais (eng) Catégories : Adhésifs conducteurs
Conducteurs organiques
NanotechnologieIndex. décimale : 668.3 Adhésifs et produits semblables Résumé : Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability Note de contenu : - Nanotechnology
- Characterizations of electrically conductive adhesives
- Isotropically conductive adhesives (ICAs)
- Anisotropically conductive adhesives/films (ACA/ACF)
- Non-conductive adhesives/films (NCA/NCF)
- Conductive nano-inks
- Intrinsically conducting polymers (ICPs)
- Future trend of conductive adhesive technologyPermalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=30219 Réservation
Réserver ce document
Exemplaires (1)
Code-barres Cote Support Localisation Section Disponibilité 19718 668.3 LI Monographie Bibliothèque principale Documentaires Disponible