| Titre : |
Recent advances in die-attach film adhesives : Die-attach film adhesives can enable more advanced technology for packaging semiconductor devices |
| Type de document : |
texte imprimé |
| Auteurs : |
Frederick Lo, Auteur ; Maurice Leblon, Auteur ; Richard Amigh, Auteur ; Kevin Chung, Auteur |
| Année de publication : |
2014 |
| Note générale : |
Bibliogr. |
| Langues : |
Américain (ame) |
| Catégories : |
Adhésifs dans les équipements électriques/électroniques
Films adhésifs
Rubans adhésifs
|
| Index. décimale : |
668.3 Adhésifs et produits semblables |
| Résumé : |
Using die-attach film at the wafer level compared to using die-attach material on individual die offers many benefits. To completely take advantage of the use of die-attach film at the wafer level, the die-attach film has to be optimized to account for various process conditions that the film has to successfully pass through without degradation in any of its end use properties, including adhesion strength and thermal and electrical properties.
Recently, the demand for handheld devices has led to more advanced technologies in 2.5-D and 3-D packaging, and in the handling of extremely thin wafers and dies. The material supply industry has responded by providing newer generations of die-attach films and wafer protection material to these increasingly demanding challenges. Packaging using wire-bonding, flip-chip soldering or the direct mechanical contact attach from flip-chip to bond pads effectively dictates the choice of different wafer level die-attach solutions. |
| Note de contenu : |
- Interconnections at the wafer level
- Advanced die bonding and stress relief
- Through silicon via interconnection |
| En ligne : |
http://www.adhesivesmag.com/articles/93392-recent-advances-in-die-attach-film-ad [...] |
| Format de la ressource électronique : |
Web |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=24364 |
in ADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 21, N° 11 (11/2014)
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