Titre : |
Electrical conductive adhesives with nanotechnologies |
Type de document : |
texte imprimé |
Auteurs : |
Yi Li, Auteur ; Daniel Lu, Auteur ; C. P. Wong, Auteur |
Editeur : |
New York [United States] : Springer |
Année de publication : |
2010 |
Importance : |
XII-437 p. |
Présentation : |
ill. |
Format : |
24 cm |
ISBN/ISSN/EAN : |
978-1-4899-8307-7 |
Prix : |
131 E |
Note générale : |
Index - Bibliogr. |
Langues : |
Anglais (eng) |
Catégories : |
Adhésifs conducteurs Conducteurs organiques Nanotechnologie
|
Index. décimale : |
668.3 Adhésifs et produits semblables |
Résumé : |
Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability |
Note de contenu : |
- Nanotechnology
- Characterizations of electrically conductive adhesives
- Isotropically conductive adhesives (ICAs)
- Anisotropically conductive adhesives/films (ACA/ACF)
- Non-conductive adhesives/films (NCA/NCF)
- Conductive nano-inks
- Intrinsically conducting polymers (ICPs)
- Future trend of conductive adhesive technology |
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