Functionalization of ceramic fibers by metallic sputter coating / Qufu Wei in JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH, Vol. 7, N° 1 (01/2010)  

[article]  inJOURNAL OF COATINGS TECHNOLOGY AND RESEARCH > Vol. 7, N° 1 (01/2010) . - p. 99-103 Titre : Functionalization of ceramic fibers by metallic sputter coating Type de document : texte imprimé Auteurs : Qufu Wei, Auteur ; Dongfeng Shao, Auteur ; Bingyao Deng, Auteur ; Qiuxiang Xu, Auteur Année de publication : 2010 Article en page(s) : p. 99-103 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Adhésion Cuivre Dépôt par pulvérisation Fibres céramiques Poudres métalliques Surfaces fonctionnelles Index. décimale : 667.9 Revêtements et enduits Résumé : Ceramic fibers were functionalized by the sputter coating of copper in this study. The surface and interface structures of the functionalized ceramic fibers were investigated by atomic force microscopy (AFM) and environmental scanning electron microscopy (ESEM). The observations by AFM revealed the formation of nanoclusters on the fiber surface. The coated layer of the sputtered copper was also confirmed by the ESEM examination, equipped with an energy-dispersive X-ray analysis. It was also found that the electrical resistance of the ceramic fibers decreased with increased coating thickness. The interfacial bonding between fibrous substrate and sputter-coated copper was investigated and discussed by peel-off tests in this study. The mechanism of the interfacial adhesion between copper and fiber substrate was also discussed. DOI : 10.1007/s11998-009-9164-6 En ligne : https://link.springer.com/content/pdf/10.1007%2Fs11998-009-9164-6.pdf Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=8352 [article]

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Functionalization of polyamide 6 nanofibers by electroless deposition of copper / Dan Tao in JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH, Vol. 5, N° 3 (09/2008)  

[article]  inJOURNAL OF COATINGS TECHNOLOGY AND RESEARCH > Vol. 5, N° 3 (09/2008) . - p. 399-403 Titre : Functionalization of polyamide 6 nanofibers by electroless deposition of copper Type de document : texte imprimé Auteurs : Dan Tao, Auteur ; Qufu Wei, Auteur ; Qiuxiang Xu, Auteur ; Lingyan Sun, Auteur Année de publication : 2008 Article en page(s) : p. 399-403 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Conduction électrique Cuivre Electrofilature Microscopie à force atomique Nanofibres Polyamide 6 Projection au plasma Surfaces fonctionnelles Index. décimale : 667.9 Revêtements et enduits Résumé : Polyamide 6 (PA6) nanofibers were prepared via electrospinning. The electrospun PA6 nanofibers were functionalized using electroless deposition technique. Oxygen low temperature plasma treatment was applied to substitute the conventional roughening process using concentrated sulfuric acid-potassium dichromate. The deposition of copper (Cu) on the PA6 nanofibers was characterized using scanning electron microscopy (SEM), atomic force microscopy (AFM), and energy dispersive X-ray spectroscopy (EDX). The observations revealed the uniform coating of the PA6 nanofibers with thin films of Cu. It was also found that the surface conductivity of the PA6 nanofibers was significantly improved by the Cu deposition. The combination of electrospinning and electroless deposition will provide a new approach to producing the functional nanofibers for various applications. DOI : 10.1007/s11998-008-9118-4 En ligne : https://link.springer.com/content/pdf/10.1007%2Fs11998-008-9118-4.pdf Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=2984 [article]

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