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Energizing product designs with electrically conductive adhesives / Deepak Hariharan in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 16, N° 6 (06/2009)
[article]
Titre : Energizing product designs with electrically conductive adhesives Type de document : texte imprimé Auteurs : Deepak Hariharan, Auteur Année de publication : 2009 Article en page(s) : p. 26-27 Langues : Américain (ame) Catégories : Adhésifs -- Applications industrielles
Adhésifs conducteurs
Adhésifs sensibles à la pression
Conducteurs organiquesIndex. décimale : 668.3 Adhésifs et produits semblables Résumé : As electronic devices become increasingly smaller and more complex, reducing the size of component space becomes more important. Electrically conductive pressure-sensitive adhesives (PSAs) enable smaller electronic designs through thin, effective bonds because they not only bond components together, but also provide the added functionality of providing pathways for electrical currents. By eliminating the need for other conductive elements, electrically conductive PSAs present options for simplifying electronic device design and manufacture. Electrically conductive PSAs are suited for applications such as electrical interconnections for low-current circuits; splicing conductive materials; bonding electromagnetic interference gaskets; ground plane assembly ; and static control for printed circuit boards and assembly.
The days of "glue" simply bonding electrical components have passed. Today’s adhesive systems have evolved into sophisticated polymer formulations capable of delivering reliable bonds with added functionality. For example, electrically conductive PSAs are highly tailored polymer formulations loaded with materials to create conductive properties in the adhesive. The adhesive is then coated onto a carrier/substrate that may also contribute to the tape’s conductive properties in single- or double-faced constructions. PSAs may also take the form of a self-wound transfer adhesive.Note de contenu : - Performance is key
- Applying the technology
- Electrically conductive bus bars for photovoltaic modulesEn ligne : http://www.adhesivesmag.com/articles/88173-energizing-product-designs-with-elect [...] Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=25907
in ADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 16, N° 6 (06/2009) . - p. 26-27[article]Réservation
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Code-barres Cote Support Localisation Section Disponibilité 011389 - Périodique Bibliothèque principale Documentaires Disponible Ultra low voltage curing of acrylic hot melt PSAs / Roopram Ramharack in ADHESIVES AGE, Vol. 39, N° 13 (12/1996)
[article]
Titre : Ultra low voltage curing of acrylic hot melt PSAs Type de document : texte imprimé Auteurs : Roopram Ramharack, Auteur ; Rama Chandran, Auteur ; Smita Shah, Auteur ; Deepak Hariharan, Auteur ; John Orloff, Auteur ; Paul Foreman, Auteur Année de publication : 1996 Article en page(s) : p. 40-43 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Adhésifs thermofusibles
Etat fondu (matériaux)
Polyacryliques
Réticulation (polymérisation)
ViscositéIndex. décimale : 668.3 Adhésifs et produits semblables Résumé : Recent advances in electron beam equipment design and in materials development have made EB curing of pressure sensitive adhesives affordable, practical and possible. Note de contenu : - ADVANTAGES OF RADIATION PROCESSING
- POLYMER SYNTHESIS : EB polymer - UV polymer
- VISCOSITY PROFILES
- CURED POLYMER PROPERTIES
- ULTRA LOW VOLTAGE CURE
- APPLICATIONSEn ligne : https://drive.google.com/file/d/1Zsd0nev01LJmDsyQVyQo5HGUPhEYqICt/view?usp=drive [...] Format de la ressource électronique : Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=20554
in ADHESIVES AGE > Vol. 39, N° 13 (12/1996) . - p. 40-43[article]Exemplaires (1)
Code-barres Cote Support Localisation Section Disponibilité 001070 - Périodique Bibliothèque principale Documentaires Exclu du prêt