| Titre : |
Light curing adhesives in electronics manufacturing : three case studies |
| Type de document : |
texte imprimé |
| Auteurs : |
Peter Swanson, Auteur |
| Année de publication : |
1996 |
| Article en page(s) : |
p. 22-32 |
| Note générale : |
Bibliogr. |
| Langues : |
Américain (ame) |
| Catégories : |
Adhésifs -- Séchage sous rayonnement ultraviolet
Electronique -- Matériaux
Electronique imprimée
Photoréticulation
|
| Index. décimale : |
668.3 Adhésifs et produits semblables |
| Résumé : |
It is well known that adhesives use is growing throughout all industries, not just electronics, but it might come as a surprise to know that industry spends more money on materials and accessories for adhesive bonding than for welding (1). It will not be many years before one might amend that adage to include soldering as well.
It is said that designers still regard adhesive technology with some suspicion, although this should not be the case in the electronics industry. The construction of the circuit board itself uses adhesive technology, as do most of the components on it. By volume, there is certainly more adhesive and protective resin than metal in a pcb assembly.
However, production managers and process engineers need to be given confidence that adhesives do not need to be applied in either near-laboratory conditions, or, conversely, the electronics factory equivalent to the Augean stables. Practical adhesive application can be clean, fast and economical. |
| Note de contenu : |
- Industry drivers
- Light or photo curing
- Case study a : Printed circuit board assembly applications : Benefits - Problems to be resolved - other applications - cost justification
- Case study b : Window sealing and bonding : History - A new adhesive - Benefits - Cost implications
- Case study c : Encapsulation
- Demand cure |
| En ligne : |
https://drive.google.com/file/d/1Dm6Si0jkqfA0Zy3S4z9cCfO-EsJ-GoBB/view?usp=drive [...] |
| Format de la ressource électronique : |
Pdf |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=20552 |
in ADHESIVES AGE > Vol. 39, N° 13 (12/1996) . - p. 22-32
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