Big things in small packages / Sabine Herold in ADHESIVES AGE, Vol. 44, N° 2 (02/2001)  

[article]  inADHESIVES AGE > Vol. 44, N° 2 (02/2001) . - p. 27-32 Titre : Big things in small packages : New adhesives provide opportunities in the electronics market Type de document : texte imprimé Auteurs : Sabine Herold, Auteur Année de publication : 2001 Article en page(s) : p. 27-32 Langues : Américain (ame) Catégories : Adhésifs -- Séchage sous rayonnement ultraviolet Colles:Adhésifs Electronique -- Matériaux Epoxydes Photoamorceurs (chimie) Réticulation (polymérisation) Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Due to the development of new curing mechanisms and the resulting cure time of seconds, the joining technique of bonding could open new application fields. Particularly in the field of electronics and electrotechnics, the use of photo-initiated adhesives will enable a rational and secure production process. By developing stress-equalizing, high flexible products, the limits of conventional adhesive systems can be overcome. In the cas of bonding and casting applications which are also confronted with high demands regarding the ougassing and corrosion potential, these innovative products create new horizons in functionality and longevity. Note de contenu : - Photo-initiated adhesives - Embedding of coils - Miniature loudspeakers for cellular phones - Relais-sealing En ligne : https://drive.google.com/file/d/115bSz3g43fQ22RjRJnmyhZeanEQXwtJ1/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19745 [article]

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Big things in small packages / Sabine Herold in ADHESIVES AGE, Vol. 45, N° 3 (03/2002)  

[article]  inADHESIVES AGE > Vol. 45, N° 3 (03/2002) . - p. s12-s14 Titre : Big things in small packages : New adhesives provide opportunities in the electronics market Type de document : texte imprimé Auteurs : Sabine Herold, Auteur Année de publication : 2002 Article en page(s) : p. s12-s14 Langues : Américain (ame) Catégories : Adhésifs -- Séchage sous rayonnement ultraviolet Collage Colles:Adhésifs Electronique -- Matériaux Epoxydes Photoamorceurs (chimie) Photoréticulation Polyacrylates Réticulation (polymérisation) Index. décimale : 668.3 Adhésifs et produits semblables Résumé : The joining technique "bonding" has become more and more important in electronics. The reason for this is the trend towards miniaturization of modules, structural components and end products. The task of bonding very different materials onto a minimum of space securely, permanently and economically makes the usage of classical joining techniques, such as screwing, riveting or welding, nearly impossible. The adhesive, however, which is optimally adjusted to the application, is ideal. Due to the globalization of markets and the trend towards outsourcing, the image of modern production firms is dominated more and more by industrial mass production. This leads towards the demand for adhesive applications to be served by products that enable mass production with very short cycle times. Photo-initiated adhesives fulfill this requirement perfectly. Recently, significant successes have been achieved in the development of light-curing acrylates and light-activated epoxies. These products are particularly suitable for industrial production applications, where their rapid curing characteristics allow short cycle times. At the same time, these materials meet the increasing requirements of the electronics industry for electrical and thermal properties as well as chemical and corrosion resistance. Additionally, initiation with radiation in the visible spectrum allows the curing of these materials in applications where it needs to be cured through transparent plastics, such as PMMA, PC or PVC. Due to the absorption of ultraviolet radiation by such plastics, this cannot usually be achieved by standard UV-curing adhesives. Different adhesive systems with their curing mechanisms and characteristics will be introduced. By comparing different development stages, the outstanding properties of the latest generation of these adhesives are seen. By way of several examples, the possibilities of commercial mass production in the electronics industry can be demonstrated. As a result of research and development activities, products can be offered which have, apart from the features mentioned previously, good adhesive and cohesive strenght together with high flexibility. Note de contenu : - Photo-initiated adhesives - Embedding of coils - Miniature loudspeakers for cellular phones - Relais-sealing En ligne : https://drive.google.com/file/d/1WdnpKEgH6f-A9Ms0tYC_x_eiX_UmK_xX/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19994 [article]

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