Titre : |
Optimised processes without a major investment in testing |
Type de document : |
texte imprimé |
Auteurs : |
Manfred Peschka, Auteur ; Holger Fricke, Auteur |
Année de publication : |
2008 |
Article en page(s) : |
p. 36-39 |
Langues : |
Multilingue (mul) |
Catégories : |
Adhésifs -- Appareils et matériel Adhésifs -- Application-dosage Adhésifs thermofusibles Dynamique des fluides computationnelle Pompes à piston Rhéologie Simulation par ordinateur
|
Index. décimale : |
668.3 Adhésifs et produits semblables |
Résumé : |
Simulation in adhesive manufacturing technology - Rationalised production processes are accompanied by a reduction in cycle times and a corresponding increase in the demands for reproducibility. In the case of adhesives, this applies to the processing speed and the increasing efficiency of the application procedure. One tool for optimising the application of adhesives in computational fluid dynamics simulation (CFD). This article describes the possibilities of this procedure and gives practical examples of its application. |
Note de contenu : |
- Optimising an applicaiton valve
- The inside of a piston pump
- Identifying effects and applying the results in practice
- FIGURES : 1. The input and ouput figures for a computational fluid dynamics simulation of adhesive processing systems - 2. The cross-sectional model of a dispensing head for hotmelt adhesives and the resulting model of the area through which the fluid flows - 3 The flow pattern of the area through which the fluid flow indicates the limites for optimising the flow throughput of the dispensing head - 4. The cutaway model of a horizontal dispensing head shows the direction of flow reversing when the valve needle is closed (because the cylinder is symmetrical, only half of it is shown) - 5. Speed distribution inside a piston valve in a dual-action piston pump on the downstroke. |
En ligne : |
https://drive.google.com/file/d/1CA2kb_jOcZMWTc_XY_d8IEP19TzmK31J/view?usp=drive [...] |
Format de la ressource électronique : |
Pdf |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=25477 |
in ADHESION - ADHESIVES + SEALANTS > N° 4/2008 (04/2008) . - p. 36-39