Developing pressure-sensitive adhesives for low-temperature applications / Alejandro C. Esquivel de la Garza in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 21, N° 7 (07/2014)  

[article]  inADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 21, N° 7 (07/2014) Titre : Developing pressure-sensitive adhesives for low-temperature applications Type de document : texte imprimé Auteurs : Alejandro C. Esquivel de la Garza, Auteur Année de publication : 2014 Langues : Américain (ame) Catégories : Adhésifs -- Emballages Adhésifs sensibles à la pression Copolymère styrène butadiène styrène Copolymère styrène isoprène styrène Etiquettes Rubans adhésifs Transition vitreuse Index. décimale : 668.3 Adhésifs et produits semblables Résumé : FINAT defines low-temperature adhesion as the ability of pressure-sensitive coated material to adhere at temperatures below 5°C. Today, many applications require adhesion that must be maintained at temperatures of -25°C or lower. One of the main characteristics of pressure-sensitive adhesives (PSAs) is their viscoelastic character, which allows optimal mobility for wetting substrate surfaces in order to bond and obtain maximal adhesion, while absorbing energy as viscoelastic deformation to maintain an effective bonding. Viscoelastic character of an adhesive is given by the elastomeric polymer present in its formulation. PSAs used in applications like tapes and labels for frozen food packaging and other applications in cold environments require special attention for the ingredients selection and, more specifically, in the polymer selection. At temperatures below the glass-transition temperature (Tg), a polymer has a brittle consistency and loses its deformation capacity. Consequently, an adhesive made with that polymer loses its mobility and elastomeric capacity to maintain the adhesion. It is therefore important to select a polymer that will adequately maintain its elastomeric characteristics at reduced temperatures; this is a low-Tg polymer. En ligne : http://www.adhesivesmag.com/articles/93037-developing-pressure-sensitive-adhesiv [...] Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=24308 [article]

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Packaging Productivity / Martha Belem Mendieta in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 17, N° 3 (03/2010)  

[article]  inADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 17, N° 3 (03/2010) . - p. 18-20 Titre : Packaging Productivity : Measuring non-pressure-sensitive adhesives’ hot tack to improve productivity in packaging processes Type de document : texte imprimé Auteurs : Martha Belem Mendieta, Auteur ; Alejandro C. Esquivel de la Garza, Auteur Année de publication : 2010 Article en page(s) : p. 18-20 Langues : Américain (ame) Catégories : Adhésifs sensibles à la pression Adhésifs thermofusibles Copolymère styrène butadiène styrène Emballages Rhéologie Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Many characterization techniques are used to measure the bond strength of hot-melt pressure-sensitive adhesives (HMPSAs). These calculations are usually performed by measuring the force required to debond the adhesive holding two substrates together. Measurement procedures vary by substrate, contact time, area and force used to make the bond ; debonding procedure variables include speed and the debonding angle. PSAs are typically soft and tacky at temperatures higher than their glass-transition temperature (Tg) ; conversely, they are firmer at lower-than-ambient temperatures. This allows tack to be measured at standard evaluation conditions (23°C and 50 % relative humidity). Unlike HMPSAs, hot-melt non-pressure-sensitive-adhesives (HMNPSAs) do not develop tack at room temperature. Instead, they become tacky when they are applied at high temperatures; after cooling to room temperature, tack is lost. Therefore, procedures commonly used to measure tack cannot be used to evaluate these materials. In some packaging processes, such as carton box forming and closure using HMAs, optimal process productivity depends on the right application temperature for optimal cohesion. Long and costly trial-and-error tests are usually used to find optimal application temperature for NPSAs for those applications. This article discusses probe-tack measurements and rheological results at high temperatures for HMNPSAs formulated with Dynasol styrene-butadiene-styrene (SBS) copolymers. En ligne : http://www.adhesivesmag.com/Articles/Feature_Article/BNP_GUID_9-5-2006_A_1000000 [...] Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=8818 [article]

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UV curing with lasers / Cuauhtémoc Pozos Vàsquez in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 20, N° 6 (06/2013)  

[article]  inADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 20, N° 6 (06/2013) . - p. 20-23 Titre : UV curing with lasers Type de document : texte imprimé Auteurs : Cuauhtémoc Pozos Vàsquez, Auteur ; Alejandro C. Esquivel de la Garza, Auteur ; Raúl J. Revilla Vàzquez, Auteur ; Eugenio Rodríguez Gonzalez, Auteur Année de publication : 2013 Article en page(s) : p. 20-23 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Adhésifs -- Séchage sous rayonnement ultraviolet Caoutchouc styrène-butadiène Copolymères séquencés Lasers à excimères Réticulation (polymérisation) Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Lasers may provide the ultimate light source to achieve ultra-fast polymerization and micronic resolution. En ligne : http://www.adhesivesmag.com/articles/91983-uv-curing-with-lasers Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=18804 [article]

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