Titre : |
ASE 85 - Adhesives, sealants and encapsulants conference - Materials, applications : Electronics - Conference proceedings : Kensington Exhibition Centre, London, UK, 5-7 November 1985 |
Type de document : |
texte imprimé |
Editeur : |
Buckingham [England] : Network Events Ltd. |
Année de publication : |
1985 |
Importance : |
235 p. |
Présentation : |
ill. |
Format : |
30 cm |
ISBN/ISSN/EAN : |
978-0-907634-77-5 |
Prix : |
45 £ |
Note générale : |
Bibliogr. |
Langues : |
Anglais (eng) |
Catégories : |
Adhésifs dans les équipements électriques/électroniques Assemblages collés Colles:Adhésifs Congrès et conférences Mastics
|
Index. décimale : |
668.3 Adhésifs et produits semblables |
Note de contenu : |
- MATERIALS : Polyurethane adhesives - Poly BD resins. High performance materials for encapsulants and sealants - Enhanced performance epoxide resin systems - Recent developments in cyanoacrylate adhesive technology - Modified polyolefins and hot melt adhesives - Surface pretreatments of plastics - Pressure-sensitive adhesives from modified natural rubber latex - Recent developments in polysulphide sealants - Styrenic block copolymers in weatherable hot melt sealants - Precipitated calcium carbonate fillers in low modulus thixotropic sealants - The influence of cross-linked density on the toughness of rubber modified epoxy resins -
- APPLICATIONS - ELECTRONICS : Adhesives, sealants and encapsulants in the electronics industry - Polyurethane resins for encapsulating electrical components - The reliability assessment of organic materials for coating silicon integrated circuits, microcircuits and printed circuit boards - Silicone encapsulants for electrical and electronic applications - The influence of the contact zone on the electrical shielding performance of elastomeric gasket materials - Epoxies in the electronics |
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