A parametric investigation on thermally driven edge cracking of a coating–substrate system / Xuejun Chen in JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH, Vol. 9, N° 5 (09/2012)  

[article]  inJOURNAL OF COATINGS TECHNOLOGY AND RESEARCH > Vol. 9, N° 5 (09/2012) . - p. 541-549 Titre : A parametric investigation on thermally driven edge cracking of a coating–substrate system Type de document : texte imprimé Auteurs : Xuejun Chen, Auteur ; Qi Liu, Auteur ; Qian Ma, Auteur Année de publication : 2012 Article en page(s) : p. 541-549 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Contraintes thermiques Eléments finis, Méthode des Revêtements Index. décimale : 667.9 Revêtements et enduits Résumé : In this article, the thermally driven edge-cracking behavior of a coating–substrate system has been investigated. The transient thermal stress field has been derived in a closed form for the corresponding uncracked counterpart medium. By applying the equal thermal stresses but with opposite sign on the crack surface to be the only external load, the thermal stress intensity factors (TSIFs) at the crack tip were then obtained. The finite element method was utilized to implement the calculation. Based on dimensional analysis, the main dimensionless parameters affecting TSIFs were identified, and the dependence of TSIFs on these parameters was illustrated, such as dimensionless time, crack depth, and thermal constants as well as mechanical constants. These results may provide some useful references for designing a coating–substrate system under rapidly changing thermal environments. Note de contenu : - EVOLUTION OF TEMPERATURE AND THERMAL STRESS FIELD - THERMAL STRESS INTENSITY FACTORS : Finite element model - Dimensional analysis - RESULTS AND DISCUSSION : Temperature and thermal stress field - Thermal stress intensity factors DOI : 10.1007/s11998-012-9404-z En ligne : https://link.springer.com/content/pdf/10.1007%2Fs11998-012-9404-z.pdf Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=16025 [article]

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Role of an interface crack for the blistering mode of a stiff film on a compliant substrate / Peixia Gu in JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH, Vol. 19, N° 2 (03/2022)  

[article]  inJOURNAL OF COATINGS TECHNOLOGY AND RESEARCH > Vol. 19, N° 2 (03/2022) . - p. 661-669 Titre : Role of an interface crack for the blistering mode of a stiff film on a compliant substrate Type de document : texte imprimé Auteurs : Peixia Gu, Auteur ; Xuejun Chen, Auteur Année de publication : 2022 Article en page(s) : p. 661-669 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Cloquage (défauts) Couches minces -- Défauts Eléments finis, Méthode des Interfaces (Sciences physiques) Revêtements -- Défauts Revêtements -- Fissuration Index. décimale : 667.9 Revêtements et enduits Résumé : A stiff thin film deposited over an underlying compliant substrate is susceptible to blistering when it is subjected to excessive in-plane compressive stresses. Two kinds of blistering modes (wrinkling and buckling) have been revealed in experiments, depending on the properties of film/substrate pair as well as that of interface adhesion. The purpose of this work is to quantify the role of an interface crack for the selection of such blistering modes in compressed thin films. By a semi-analytical approach, the transitional size of an interface crack is identified at which both wrinkling mode and buckling mode may arise. The mode selection diagram is constructed and characterized with respect to the normalized interface crack size and compressive strain. The theoretical estimations are validated by a finite element method incorporating an interface cohesive zone model and are demonstrated to be in reasonable agreement with experimental observations in previous literature. The results in this work are expected to be helpful in the effective design and evaluation of thin-film devices. Note de contenu : - MODEL DESCRIPTION - FINITE ELEMENT SIMULATION : Finite element model - Interface cohesive zone model - RESULTS AND DISCUSSION : Mode selection diagram - Validations DOI : https://doi.org/10.1007/s11998-021-00556-z En ligne : https://link.springer.com/content/pdf/10.1007/s11998-021-00556-z.pdf Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=37295 [article]

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