| Titre : |
A flexible method for applying adhesives to printed circuit boards |
| Type de document : |
texte imprimé |
| Auteurs : |
Richard R. Lathrop, Auteur |
| Année de publication : |
1998 |
| Article en page(s) : |
p. 22-33 |
| Note générale : |
Bibliogr. |
| Langues : |
Américain (ame) |
| Catégories : |
Colles:Adhésifs
Electronique -- Matériaux
Electronique imprimée
Rhéologie
|
| Index. décimale : |
668.3 Adhésifs et produits semblables |
| Résumé : |
Adhesive is applied for holding surface mount technology (SMT) components to the bottom side of mixed technology boards during the wave solder operation. Although adhesive printing has been utilized in lieu of high speed dispensing for years, renewed interest due to higher speed chip shooters has driven material manufacturers toward developing adhesives with custom tailored rheologies for printing. Printable adhesives have been developed to yield a wide range of deposit heights from a single stencil thickness. Laser triangulation measurement methods have been used to quantify the printability of these new adhesives. The printability results discussed in this article compare the dispensable PD944 versus the printable PD955PY adhesive products by Heraeus. |
| Note de contenu : |
- Printing dispensable adhesives
- Printable rheology adhesives
- Quantifying adhesive printability
- Print process choices
- Single-stroke print cycle
- Print-flood print cycle
- Design guidelines |
| En ligne : |
https://drive.google.com/file/d/18cuyVC-Y_ZtTLJEH9ugyJQbNQZXy-fac/view?usp=drive [...] |
| Format de la ressource électronique : |
Pdf |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=20340 |
in ADHESIVES AGE > Vol. 41, N° 12 (12/1998) . - p. 22-33
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A flexible method for applying adhesives to printed circuit boards in ADHESIVES AGE, Vol. 41, N° 12 (12/1998)
