| Titre : |
Beat the heat : New challenges for curing material on heat-sensitive substrates |
| Type de document : |
texte imprimé |
| Auteurs : |
N. Julian K. Danvers, Auteur |
| Année de publication : |
2001 |
| Article en page(s) : |
p. 32-37 et p. 48 |
| Langues : |
Américain (ame) |
| Catégories : |
Adhésifs -- Séchage sous rayonnement ultraviolet
Adhésifs thermofusibles
Electrodes
Micro-ondes
Réflectivité thermique
Systèmes de refroidissement
|
| Index. décimale : |
668.3 Adhésifs et produits semblables |
| Résumé : |
With the advances being made in material science and technology, there is an increase in the amount of polymeric materials used within today's manufacturing environment. The growth of UV curing for its process, performance and environmental factors is presenting new challenges on how to best cure material on thermally sensitive substrates.
This article will look at the technology and processes that can be used when the inherent heat generated as part of the UV-source is detrimental to the substrate. It will investigate different types of UV curing systems that can be used for paying special attention to the heat transmission properties associated with them as well as looking at some sample applications in which they can be used. For the benefit of this article, discussions will be based around electrode (arc) and microwave UV equipment. While EB (electron beam) and pulsed UV are both alternative radiation-curing technologies, these will be not covered. |
| Note de contenu : |
- Technology comparison basis of UV generation
- Electrode systems
- Microwave systems
- Bulb types
- Reflector technologies
- Reflector geometry
- Focus, UV intensity and aspect ratio
- Cooling systems
- Operational differences
- Starting
- Maintenance and operating costs
- Sensitive substrates |
| En ligne : |
https://drive.google.com/file/d/1Fcun4krwfzQlSZBQYJv9US-EL7umQMKv/view?usp=drive [...] |
| Format de la ressource électronique : |
Pdf |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19958 |
in ADHESIVES AGE > Vol. 44, N° 12 (12/2001) . - p. 32-37 et p. 48
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Beat the heat in ADHESIVES AGE, Vol. 44, N° 12 (12/2001)
