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Big things in small packages / Sabine Herold in ADHESIVES AGE, Vol. 44, N° 2 (02/2001)

Titre :	Big things in small packages : New adhesives provide opportunities in the electronics market
Type de document :	texte imprimé
Auteurs :	Sabine Herold, Auteur
Année de publication :	2001
Article en page(s) :	p. 27-32
Langues :	Américain (ame)
Catégories :	Adhésifs -- Séchage sous rayonnement ultraviolet Colles:Adhésifs Electronique -- Matériaux Epoxydes Photoamorceurs (chimie) Réticulation (polymérisation)
Index. décimale :	668.3 Adhésifs et produits semblables
Résumé :	Due to the development of new curing mechanisms and the resulting cure time of seconds, the joining technique of bonding could open new application fields. Particularly in the field of electronics and electrotechnics, the use of photo-initiated adhesives will enable a rational and secure production process. By developing stress-equalizing, high flexible products, the limits of conventional adhesive systems can be overcome. In the cas of bonding and casting applications which are also confronted with high demands regarding the ougassing and corrosion potential, these innovative products create new horizons in functionality and longevity.
Note de contenu :	- Photo-initiated adhesives - Embedding of coils - Miniature loudspeakers for cellular phones - Relais-sealing
En ligne :	https://drive.google.com/file/d/115bSz3g43fQ22RjRJnmyhZeanEQXwtJ1/view?usp=drive [...]
Format de la ressource électronique :	Pdf
Permalink :	https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=19745

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