Titre : |
A review of progress in the technology and applications of offset lithographic inks |
Type de document : |
texte imprimé |
Auteurs : |
G. H. Hutchinson, Auteur |
Année de publication : |
1995 |
Article en page(s) : |
p. 188-194 |
Note générale : |
Bibliogr. |
Langues : |
Anglais (eng) |
Tags : |
Encre 'Impression plat' Lithographie Formulation Durcissement Séchage 'Article synthèse' |
Index. décimale : |
667.9 Revêtements et enduits |
Résumé : |
The emphasis has been on lithographic inks and associated materials that give best quality printing results combined with the high productivity of today's printing presses. Additionally the inks have to meet the specific needs of a wide wariety of substrates udes in publication and packaging printing-papers, carton boards, metals and plastics - also to be compatible with the significant advances in press machinery and associated aquipment technology.
There are continuing constraints brought about by ever increasing pressures of legislation. Much of this concerns environmental issues, aspects of health and safety and the welter of labelling, packaging and consumer protection regulations.
Then there have been the continuing uncertainties in the economic climate worldwide. All the above mentioned factors have a bearing on progress.
After touching on some of the significant developments and events, the intention is to discuss come work that the author has carried ouf on the absorption of vegetable oils and solvents by paper substrates. |
Note de contenu : |
- SHEET-FED OFFSET LITHOGRAPHIC INKS : Organic pigments - Resins - Organo-metallic compounds - Wax compounds - Antioxidants - Infra red heating - Varnish applications - Receptivity of ink films
- ULTRA-VIOLET CURABLE INKS IN OFFSET LITHOGRAPHY
- WATERLESS OFFSET INKS
- HEAT-SET WEB-OFFSET INKS
- DRYING OF HEAT-SET INKS
- THE ABSORPTION OF VEGETABLE OILS AND SOLVENTS BY PAPER SUBSTRATES
- FUTURE TRENDS |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=16941 |
in SURFACE COATINGS INTERNATIONAL > Vol. 78, N° 5 (05/1995) . - p. 188-194