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Studies on epoxy resin curatives and their applications / Garima Tripathi in PAINTINDIA, Vol. LVII, N° 5 (05/2007)
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Titre : Studies on epoxy resin curatives and their applications Type de document : texte imprimé Auteurs : Garima Tripathi, Auteur ; Ranjana Yadav, Auteur ; Deepak Srivastava, Auteur Année de publication : 2007 Article en page(s) : p. 101-107 Note générale : Bibliogr. Langues : Anglais (eng) Catégories : Epoxydes
Réticulants
Réticulation (polymérisation)
Revêtements:PeintureIndex. décimale : 667.9 Revêtements et enduits Résumé : The curing process is a chemical reaction in which the epoxide groups in epoxy resin reacts with such a curing agent (hardener) to form a highly cross linked, three- dimensional network. To convert epoxy resins into a hard, infusible and rigid material, it is necessary to cure the resin with hardener. Epoxy resins cure quickly and easily at partially any temperature from ambient-150°C depending on the choice of curing agent. A wide variety of curing agents for epoxy resins are available depending upon the process and properties required. The commonly used curing agents for epoxies include amines, polyamides, phenolic resins., anhydrides etc The cure kinetics and the Tg of the cured system are dependent on the molecular structure of the hardener. When selecting resin-curative combination the applications or end use defines the resin characteristics that must be built into a particular system. The materials have been separated into the general categories of room-temperature cure, room or elevated temperature elevated cure and miscellaneous curatives. In some cases a single curative or class of curatives may fit in more than one of these categories.The present article deals with the recent development, properties and modified applications of epoxy curatives. Note de contenu : - Epoxy curatives
- Room temperature curing agents
- Selection factor
- Room or elevated temperature curing agents
- Elevated temperature curatives
- Miscellaneous uses
- Relationship between cured epoxy resin structure and propertiesPermalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=11486
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