[article]
| Titre : |
Dielectric cure analysis |
| Type de document : |
texte imprimé |
| Auteurs : |
Nathaniel T. Smith, Auteur ; David D. Shepard, Auteur |
| Année de publication : |
1995 |
| Article en page(s) : |
p. 930-935 |
| Note générale : |
Bibliogr. |
| Langues : |
Anglais (eng) |
| Catégories : |
Diélectriques
Matières plastiques
Réticulation (polymérisation)
Rhéologie
Transition vitreuse
Viscosité
|
| Index. décimale : |
667.9 Revêtements et enduits |
| Résumé : |
In the past, dielectric analysis (DEA) has been used as an important measurement component in the overall analysis of polymer resin systems. Much of this work has been done at the research level in determining viscosity behavior, rate of cure, and cure endpoint. In the areas where DEA has been used in the production environment, it has been in the low volume applications of aerospace composites. Within the last several years there has been an expansion of the applications where dielectric cure analysis has been used. This growth in the applications of dielectric cure analysis has expanded beyond the traditional areas of monitoring the cure of composites to include such applications as factory floor control of molding operations, monitoring resin synthesis, reduction and/or elimination of physical testing, diffusion monitoring, and SQC analysis. These applications and other techniques will be presented. |
| Note de contenu : |
- Traditional cure comparison
- Dielectric correlation to glass transitions
- Dielectric correlation to viscosity
- Dielectric comparison with DSC
- Dielectric applications
- Research and development
- Quality assurance
- Production control
- Resin synthesis, batch reaction monitoring
- Diffusion |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=11378 |
in EUROPEAN COATINGS JOURNAL (ECJ) > N° 12/95 (12/1995) . - p. 930-935
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